APF19-19-10CB CTS Thermal Management Products
Hersteller: CTS Thermal Management Products
Description: HEATSINK LOW-PROFILE FORGED
Packaging: Box
Material: Aluminum
Length: 0.748" (19.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.748" (19.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Description: HEATSINK LOW-PROFILE FORGED
Packaging: Box
Material: Aluminum
Length: 0.748" (19.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.748" (19.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
auf Bestellung 22280 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
4+ | 4.4 EUR |
10+ | 4.29 EUR |
25+ | 4.17 EUR |
50+ | 4.08 EUR |
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Technische Details APF19-19-10CB CTS Thermal Management Products
Description: HEATSINK LOW-PROFILE FORGED, Packaging: Box, Material: Aluminum, Length: 0.748" (19.00mm), Shape: Square, Fins, Type: Top Mount, Width: 0.748" (19.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Not Included), Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM, Fin Height: 0.370" (9.40mm), Material Finish: Black Anodized.
Weitere Produktangebote APF19-19-10CB nach Preis ab 5.97 EUR bis 6.69 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||
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APF19-19-10CB | Hersteller : CTS Electronic Components | Heat Sinks 19x19x10mm |
auf Bestellung 534 Stücke: Lieferzeit 10-14 Tag (e) |
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