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Technische Details APF19-19-10CB CTS Electronic Components
Description: HEATSINK LOW-PROFILE FORGED, Material Finish: Black Anodized, Fin Height: 0.370" (9.40mm), Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM, Attachment Method: Thermal Tape, Adhesive (Not Included), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Width: 0.748" (19.00mm), Type: Top Mount, Shape: Square, Fins, Length: 0.748" (19.00mm), Material: Aluminum, Packaging: Box.
Weitere Produktangebote APF19-19-10CB nach Preis ab 3.76 EUR bis 5.1 EUR
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APF19-19-10CB | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK LOW-PROFILE FORGEDMaterial Finish: Black Anodized Fin Height: 0.370" (9.40mm) Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM Attachment Method: Thermal Tape, Adhesive (Not Included) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 0.748" (19.00mm) Type: Top Mount Shape: Square, Fins Length: 0.748" (19.00mm) Material: Aluminum Packaging: Box |
auf Bestellung 24388 Stücke: Lieferzeit 10-14 Tag (e) |
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