APF30-30-06CB/A01 CTS Electronic Components
auf Bestellung 161 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 9.77 EUR |
| 10+ | 8.85 EUR |
| 20+ | 8.31 EUR |
| 50+ | 8.13 EUR |
| 100+ | 7.85 EUR |
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Technische Details APF30-30-06CB/A01 CTS Electronic Components
Description: HEATSINK FORGED W/ADHESIVE TAPE, Packaging: Box, Material: Aluminum, Length: 1.181" (30.00mm), Shape: Square, Fins, Type: Top Mount, Width: 1.181" (30.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 4.40°C/W @ 200 LFM, Fin Height: 0.250" (6.35mm), Material Finish: Black Anodized.
Weitere Produktangebote APF30-30-06CB/A01 nach Preis ab 7.05 EUR bis 10.17 EUR
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APF30-30-06CB/A01 | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK FORGED W/ADHESIVE TAPEPackaging: Box Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 4.40°C/W @ 200 LFM Fin Height: 0.250" (6.35mm) Material Finish: Black Anodized |
auf Bestellung 1649 Stücke: Lieferzeit 10-14 Tag (e) |
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