APF30-30-06CB/A01 CTS Electronic Components
| Anzahl | Preis |
|---|---|
| 1+ | 9.77 EUR |
| 10+ | 8.85 EUR |
| 20+ | 8.31 EUR |
| 50+ | 8.13 EUR |
| 100+ | 7.85 EUR |
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Technische Details APF30-30-06CB/A01 CTS Electronic Components
Description: HEATSINK FORGED W/ADHESIVE TAPE, Material: Aluminum, Packaging: Box, Thermal Resistance @ Forced Air Flow: 4.40°C/W @ 200 LFM, Attachment Method: Thermal Tape, Adhesive (Included), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Width: 1.181" (30.00mm), Type: Top Mount, Shape: Square, Fins, Length: 1.181" (30.00mm), Material Finish: Black Anodized, Fin Height: 0.250" (6.35mm).
Weitere Produktangebote APF30-30-06CB/A01 nach Preis ab 6.9 EUR bis 9.96 EUR
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APF30-30-06CB/A01 | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK FORGED W/ADHESIVE TAPEMaterial: Aluminum Packaging: Box Thermal Resistance @ Forced Air Flow: 4.40°C/W @ 200 LFM Attachment Method: Thermal Tape, Adhesive (Included) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.181" (30.00mm) Type: Top Mount Shape: Square, Fins Length: 1.181" (30.00mm) Material Finish: Black Anodized Fin Height: 0.250" (6.35mm) |
auf Bestellung 1069 Stücke: Lieferzeit 10-14 Tag (e) |
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