| Anzahl | Preis |
|---|---|
| 1+ | 9.45 EUR |
| 10+ | 8.59 EUR |
| 25+ | 8.15 EUR |
| 50+ | 7.74 EUR |
| 100+ | 7.41 EUR |
| 300+ | 6.97 EUR |
| 600+ | 6.76 EUR |
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Technische Details APF30-30-06CB CTS Electronic Components
Description: HEATSINK LOW-PROFILE FORGED, Material Finish: Black Anodized, Fin Height: 0.250" (6.35mm), Thermal Resistance @ Forced Air Flow: 4.40°C/W @ 200 LFM, Attachment Method: Thermal Tape, Adhesive (Not Included), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Width: 1.181" (30.00mm), Type: Top Mount, Shape: Square, Fins, Length: 1.181" (30.00mm), Material: Aluminum, Packaging: Box.
Weitere Produktangebote APF30-30-06CB nach Preis ab 7.71 EUR bis 9.84 EUR
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APF30-30-06CB | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK LOW-PROFILE FORGEDMaterial Finish: Black Anodized Fin Height: 0.250" (6.35mm) Thermal Resistance @ Forced Air Flow: 4.40°C/W @ 200 LFM Attachment Method: Thermal Tape, Adhesive (Not Included) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.181" (30.00mm) Type: Top Mount Shape: Square, Fins Length: 1.181" (30.00mm) Material: Aluminum Packaging: Box |
auf Bestellung 213 Stücke: Lieferzeit 10-14 Tag (e) |
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