auf Bestellung 468 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 10.03 EUR |
| 10+ | 9.77 EUR |
| 25+ | 9.24 EUR |
| 50+ | 8.69 EUR |
| 100+ | 7.83 EUR |
| 300+ | 7.30 EUR |
| 600+ | 6.97 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details APF30-30-06CB CTS Electronic Components
Description: HEATSINK LOW-PROFILE FORGED, Packaging: Box, Material: Aluminum, Length: 1.181" (30.00mm), Shape: Square, Fins, Type: Top Mount, Width: 1.181" (30.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Not Included), Thermal Resistance @ Forced Air Flow: 4.40°C/W @ 200 LFM, Fin Height: 0.250" (6.35mm), Material Finish: Black Anodized.
Weitere Produktangebote APF30-30-06CB nach Preis ab 8.35 EUR bis 10.65 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
APF30-30-06CB | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK LOW-PROFILE FORGEDPackaging: Box Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Not Included) Thermal Resistance @ Forced Air Flow: 4.40°C/W @ 200 LFM Fin Height: 0.250" (6.35mm) Material Finish: Black Anodized |
auf Bestellung 214 Stücke: Lieferzeit 10-14 Tag (e) |
|