| Anzahl | Preis |
|---|---|
| 1+ | 10.23 EUR |
| 10+ | 9.06 EUR |
| 25+ | 8.62 EUR |
| 50+ | 8.32 EUR |
| 100+ | 8.17 EUR |
| 300+ | 7.73 EUR |
| 600+ | 7.34 EUR |
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Technische Details APF30-30-10CB CTS Electronic Components
Description: HEATSINK LOW-PROFILE FORGED, Material Finish: Black Anodized, Fin Height: 0.370" (9.40mm), Thermal Resistance @ Forced Air Flow: 3.30°C/W @ 200 LFM, Attachment Method: Thermal Tape, Adhesive (Not Included), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Width: 1.181" (30.00mm), Type: Top Mount, Shape: Square, Fins, Length: 1.181" (30.00mm), Material: Aluminum, Packaging: Box.
Weitere Produktangebote APF30-30-10CB nach Preis ab 8.92 EUR bis 10.98 EUR
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APF30-30-10CB | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK LOW-PROFILE FORGEDMaterial Finish: Black Anodized Fin Height: 0.370" (9.40mm) Thermal Resistance @ Forced Air Flow: 3.30°C/W @ 200 LFM Attachment Method: Thermal Tape, Adhesive (Not Included) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.181" (30.00mm) Type: Top Mount Shape: Square, Fins Length: 1.181" (30.00mm) Material: Aluminum Packaging: Box |
auf Bestellung 98 Stücke: Lieferzeit 10-14 Tag (e) |
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