auf Bestellung 299 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 9.72 EUR |
| 10+ | 8.62 EUR |
| 25+ | 8.22 EUR |
| 50+ | 7.94 EUR |
| 100+ | 7.67 EUR |
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Technische Details APF30-30-10CB CTS Electronic Components
Description: HEATSINK LOW-PROFILE FORGED, Packaging: Box, Material: Aluminum, Length: 1.181" (30.00mm), Shape: Square, Fins, Type: Top Mount, Width: 1.181" (30.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Not Included), Thermal Resistance @ Forced Air Flow: 3.30°C/W @ 200 LFM, Fin Height: 0.370" (9.40mm), Material Finish: Black Anodized.
Weitere Produktangebote APF30-30-10CB nach Preis ab 8.92 EUR bis 10.98 EUR
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APF30-30-10CB | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK LOW-PROFILE FORGEDPackaging: Box Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Not Included) Thermal Resistance @ Forced Air Flow: 3.30°C/W @ 200 LFM Fin Height: 0.370" (9.40mm) Material Finish: Black Anodized |
auf Bestellung 98 Stücke: Lieferzeit 10-14 Tag (e) |
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