APF30-30-13CB/A01 CTS Thermal Management Products
Hersteller: CTS Thermal Management Products
Description: HEATSINK FORGED W/ADHESIVE TAPE
Packaging: Box
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK FORGED W/ADHESIVE TAPE
Packaging: Box
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1308 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 9.66 EUR |
10+ | 9.39 EUR |
25+ | 8.86 EUR |
50+ | 8.34 EUR |
100+ | 7.82 EUR |
250+ | 7.3 EUR |
500+ | 6.78 EUR |
1000+ | 6.65 EUR |
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Technische Details APF30-30-13CB/A01 CTS Thermal Management Products
Description: HEATSINK FORGED W/ADHESIVE TAPE, Packaging: Box, Material: Aluminum, Length: 1.181" (30.00mm), Shape: Square, Fins, Type: Top Mount, Width: 1.181" (30.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM, Fin Height: 0.500" (12.70mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote APF30-30-13CB/A01 nach Preis ab 9.06 EUR bis 9.72 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||
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APF30-30-13CB/A01 | Hersteller : CTS Electronic Components | Heat Sinks 30x30x13mm Double-sided Kapton |
auf Bestellung 268 Stücke: Lieferzeit 10-14 Tag (e) |
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