APF30-30-13CB/A01 CTS Thermal Management Products

Description: HEATSINK FORGED W/ADHESIVE TAPE
Packaging: Box
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 984 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
2+ | 11.32 EUR |
10+ | 10.01 EUR |
25+ | 9.53 EUR |
50+ | 9.19 EUR |
100+ | 8.86 EUR |
300+ | 8.35 EUR |
500+ | 8.13 EUR |
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Technische Details APF30-30-13CB/A01 CTS Thermal Management Products
Description: HEATSINK FORGED W/ADHESIVE TAPE, Packaging: Box, Material: Aluminum, Length: 1.181" (30.00mm), Shape: Square, Fins, Type: Top Mount, Width: 1.181" (30.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM, Fin Height: 0.500" (12.70mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote APF30-30-13CB/A01 nach Preis ab 9.28 EUR bis 11.65 EUR
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APF30-30-13CB/A01 | Hersteller : CTS Electronic Components |
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auf Bestellung 262 Stücke: Lieferzeit 10-14 Tag (e) |
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