APF30-30-13CB CTS Thermal Management Products
Hersteller: CTS Thermal Management ProductsDescription: HEATSINK LOW-PROFILE FORGED
Packaging: Box
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 168 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 9.45 EUR |
| 10+ | 8.36 EUR |
| 25+ | 7.96 EUR |
| 50+ | 7.67 EUR |
| 100+ | 7.40 EUR |
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Technische Details APF30-30-13CB CTS Thermal Management Products
Description: HEATSINK LOW-PROFILE FORGED, Packaging: Box, Material: Aluminum, Length: 1.181" (30.00mm), Shape: Square, Fins, Type: Top Mount, Width: 1.181" (30.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Not Included), Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM, Fin Height: 0.500" (12.70mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote APF30-30-13CB nach Preis ab 6.88 EUR bis 9.72 EUR
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APF30-30-13CB | Hersteller : CTS Electronic Components |
Heat Sinks 30x30x13mm |
auf Bestellung 218 Stücke: Lieferzeit 10-14 Tag (e) |
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