| Anzahl | Preis |
|---|---|
| 1+ | 9.2 EUR |
| 10+ | 8.17 EUR |
| 25+ | 7.78 EUR |
| 50+ | 7.5 EUR |
| 100+ | 7.22 EUR |
| 300+ | 6.79 EUR |
| 600+ | 6.53 EUR |
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Technische Details APF30-30-13CB CTS Electronic Components
Description: HEATSINK LOW-PROFILE FORGED, Part Status: Active, Material Finish: Black Anodized, Fin Height: 0.500" (12.70mm), Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM, Attachment Method: Thermal Tape, Adhesive (Not Included), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Width: 1.181" (30.00mm), Type: Top Mount, Shape: Square, Fins, Length: 1.181" (30.00mm), Material: Aluminum, Packaging: Box.
Weitere Produktangebote APF30-30-13CB nach Preis ab 7.4 EUR bis 9.45 EUR
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APF30-30-13CB | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK LOW-PROFILE FORGEDPart Status: Active Material Finish: Black Anodized Fin Height: 0.500" (12.70mm) Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM Attachment Method: Thermal Tape, Adhesive (Not Included) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.181" (30.00mm) Type: Top Mount Shape: Square, Fins Length: 1.181" (30.00mm) Material: Aluminum Packaging: Box |
auf Bestellung 168 Stücke: Lieferzeit 10-14 Tag (e) |
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