auf Bestellung 309 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 8.40 EUR |
| 10+ | 8.18 EUR |
| 25+ | 7.96 EUR |
| 50+ | 7.52 EUR |
| 100+ | 6.64 EUR |
| 300+ | 6.58 EUR |
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Technische Details APF30-30-13CB CTS Electronic Components
Description: HEATSINK LOW-PROFILE FORGED, Packaging: Box, Material: Aluminum, Length: 1.181" (30.00mm), Shape: Square, Fins, Type: Top Mount, Width: 1.181" (30.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Not Included), Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM, Fin Height: 0.500" (12.70mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote APF30-30-13CB nach Preis ab 7.40 EUR bis 9.45 EUR
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APF30-30-13CB | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK LOW-PROFILE FORGEDPackaging: Box Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Not Included) Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 168 Stücke: Lieferzeit 10-14 Tag (e) |
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