APF30-30-13CB CTS Thermal Management Products
Hersteller: CTS Thermal Management Products
Description: HEATSINK LOW-PROFILE FORGED
Packaging: Box
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK LOW-PROFILE FORGED
Packaging: Box
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 317 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
3+ | 8.31 EUR |
10+ | 8.09 EUR |
25+ | 7.88 EUR |
50+ | 7.44 EUR |
100+ | 7 EUR |
250+ | 6.56 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details APF30-30-13CB CTS Thermal Management Products
Description: HEATSINK LOW-PROFILE FORGED, Packaging: Box, Material: Aluminum, Length: 1.181" (30.00mm), Shape: Square, Fins, Type: Top Mount, Width: 1.181" (30.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Not Included), Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM, Fin Height: 0.500" (12.70mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote APF30-30-13CB nach Preis ab 6.58 EUR bis 8.4 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
APF30-30-13CB | Hersteller : CTS Electronic Components | Heat Sinks 30x30x13mm |
auf Bestellung 353 Stücke: Lieferzeit 10-14 Tag (e) |
|