APF40-40-10CB CTS Thermal Management Products

Description: HEATSINK LOW-PROFILE FORGED
Packaging: Box
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
auf Bestellung 237 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
2+ | 11.49 EUR |
10+ | 10.17 EUR |
25+ | 9.68 EUR |
50+ | 9.33 EUR |
100+ | 9.00 EUR |
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Technische Details APF40-40-10CB CTS Thermal Management Products
Description: HEATSINK LOW-PROFILE FORGED, Packaging: Box, Material: Aluminum, Length: 1.575" (40.00mm), Shape: Square, Fins, Type: Top Mount, Width: 1.575" (40.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Not Included), Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM, Fin Height: 0.370" (9.40mm), Material Finish: Black Anodized.
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Foto | Bezeichnung | Hersteller | Beschreibung |
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APF40-40-10CB | Hersteller : CTS Electronic Components |
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