auf Bestellung 299 Stücke:
Lieferzeit 104-108 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 15.96 EUR |
| 10+ | 15.56 EUR |
| 25+ | 14.68 EUR |
| 50+ | 13.82 EUR |
| 100+ | 12.95 EUR |
| 300+ | 12.09 EUR |
| 600+ | 11.21 EUR |
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Technische Details APF40-40-13CB CTS Electronic Components
Description: HEATSINK LOW-PROFILE FORGED, Packaging: Box, Material: Aluminum, Length: 1.575" (40.00mm), Shape: Square, Fins, Type: Top Mount, Width: 1.575" (40.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Not Included), Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM, Fin Height: 0.500" (12.70mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote APF40-40-13CB
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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APF40-40-13CB | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK LOW-PROFILE FORGEDPackaging: Box Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Not Included) Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized Part Status: Active |
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