| Anzahl | Preis |
|---|---|
| 1+ | 15.22 EUR |
| 10+ | 13.57 EUR |
| 25+ | 12.94 EUR |
| 50+ | 12.46 EUR |
| 100+ | 12.02 EUR |
| 250+ | 11.33 EUR |
| 500+ | 10.75 EUR |
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Technische Details APF40-40-13CB CTS Electronic Components
Description: HEATSINK LOW-PROFILE FORGED, Part Status: Active, Material Finish: Black Anodized, Fin Height: 0.500" (12.70mm), Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM, Attachment Method: Thermal Tape, Adhesive (Not Included), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Width: 1.575" (40.00mm), Type: Top Mount, Shape: Square, Fins, Length: 1.575" (40.00mm), Material: Aluminum, Packaging: Box.
Weitere Produktangebote APF40-40-13CB
| Foto | Bezeichnung | Hersteller | Beschreibung |
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APF40-40-13CB | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK LOW-PROFILE FORGEDPart Status: Active Material Finish: Black Anodized Fin Height: 0.500" (12.70mm) Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM Attachment Method: Thermal Tape, Adhesive (Not Included) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.575" (40.00mm) Type: Top Mount Shape: Square, Fins Length: 1.575" (40.00mm) Material: Aluminum Packaging: Box |
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