APF6-060-03.5-S-04-2-A-TR Samtec
Hersteller: Samtec
Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Socket
| Anzahl | Privatkunde |
|---|---|
| 1+ | 85.85 EUR |
| 50+ | 61.15 EUR |
| 100+ | 57.45 EUR |
| 250+ | 55.09 EUR |
| 500+ | 50.4 EUR |
| 1000+ | 50.37 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details APF6-060-03.5-S-04-2-A-TR Samtec
Description: 0.635 MM PITCH ACCELERATE HP HIG, Features: Board Guide, Packaging: Bulk, Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 240, Pitch: 0.025" (0.64mm), Height Above Board: 0.144" (3.66mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 5mm, 10mm, Number of Rows: 4.
Weitere Produktangebote APF6-060-03.5-S-04-2-A-TR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
| APF6-060-03.5-S-04-2-A-TR | Samtec Inc. |
Description: 0.635 MM PITCH ACCELERATE HP HIGFeatures: Board Guide Packaging: Bulk Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 240 Pitch: 0.025" (0.64mm) Height Above Board: 0.144" (3.66mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 5mm, 10mm Number of Rows: 4 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH |
| APF6-060-03.5-S-04-2-A-TR |
![]() |
Hersteller: Samtec Inc.
Description: 0.635 MM PITCH ACCELERATE HP HIG
Features: Board Guide
Packaging: Bulk
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 240
Pitch: 0.025" (0.64mm)
Height Above Board: 0.144" (3.66mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 5mm, 10mm
Number of Rows: 4
Description: 0.635 MM PITCH ACCELERATE HP HIG
Features: Board Guide
Packaging: Bulk
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 240
Pitch: 0.025" (0.64mm)
Height Above Board: 0.144" (3.66mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 5mm, 10mm
Number of Rows: 4
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH

