APF6-060-03.5-S-04-2-A-TR Samtec
Hersteller: SamtecBoard to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Socket
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 72.14 EUR |
| 50+ | 51.39 EUR |
| 100+ | 48.28 EUR |
| 250+ | 46.29 EUR |
| 500+ | 42.35 EUR |
| 1000+ | 42.33 EUR |
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Technische Details APF6-060-03.5-S-04-2-A-TR Samtec
Description: 0.635 MM PITCH ACCELERATE HP HIG, Packaging: Bulk, Features: Board Guide, Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 240, Pitch: 0.025" (0.64mm), Height Above Board: 0.144" (3.66mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 5mm, 10mm, Number of Rows: 4.
Weitere Produktangebote APF6-060-03.5-S-04-2-A-TR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| APF6-060-03.5-S-04-2-A-TR | Hersteller : Samtec Inc. |
Description: 0.635 MM PITCH ACCELERATE HP HIG Packaging: Bulk Features: Board Guide Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 240 Pitch: 0.025" (0.64mm) Height Above Board: 0.144" (3.66mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 5mm, 10mm Number of Rows: 4 |
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