Produkte > SAMTEC INC. > APF6-100-03.5-S-04-2

APF6-100-03.5-S-04-2 Samtec Inc.

Hersteller: Samtec Inc.
Description: 0.635 MM PITCH ACCELERATE HP HIG
Packaging: Bulk
Number of Rows: 4
Mated Stacking Heights: 5mm, 10mm
Contact Finish Thickness: 30.0µin (0.76µm)
Height Above Board: 0.144" (3.66mm)
Pitch: 0.025" (0.64mm)
Number of Positions: 400
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: High Density Array, Female

Produkt ist nicht verfügbar

Im Einkaufswagen Stück im Wert von UAH

Produktrezensionen

Produktbewertung abgeben

Technische Details APF6-100-03.5-S-04-2 Samtec Inc.

Description: 0.635 MM PITCH ACCELERATE HP HIG, Packaging: Bulk, Number of Rows: 4, Mated Stacking Heights: 5mm, 10mm, Contact Finish Thickness: 30.0µin (0.76µm), Height Above Board: 0.144" (3.66mm), Pitch: 0.025" (0.64mm), Number of Positions: 400, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: High Density Array, Female.