APM6-100-01.5-L-08-0-TR Samtec Inc.
Hersteller: Samtec Inc.
Description: 0.635 MM ACCELERATE HP HIGH-PERF
Number of Rows: 8
Mated Stacking Heights: 5mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.144" (3.66mm)
Pitch: 0.025" (0.64mm)
Number of Positions: 800
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: High Density Array, Female
Features: Board Guide
Packaging: Tape & Reel (TR)
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Technische Details APM6-100-01.5-L-08-0-TR Samtec Inc.
Description: 0.635 MM ACCELERATE HP HIGH-PERF, Number of Rows: 8, Mated Stacking Heights: 5mm, Contact Finish Thickness: 10.0µin (0.25µm), Height Above Board: 0.144" (3.66mm), Pitch: 0.025" (0.64mm), Number of Positions: 800, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: High Density Array, Female, Features: Board Guide, Packaging: Tape & Reel (TR).
Weitere Produktangebote APM6-100-01.5-L-08-0-TR nach Preis ab 79.31 EUR bis 117.53 EUR
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APM6-100-01.5-L-08-0-TR | Samtec Inc. |
Description: 0.635 MM ACCELERATE HP HIGH-PERF Number of Rows: 8 Mated Stacking Heights: 5mm Contact Finish Thickness: 10.0µin (0.25µm) Height Above Board: 0.144" (3.66mm) Pitch: 0.025" (0.64mm) Number of Positions: 800 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: High Density Array, Female Features: Board Guide Packaging: Cut Tape (CT) |
auf Bestellung 300 Stücke: Lieferzeit 10-14 Tag (e) |
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APM6-100-01.5-L-08-0-TR | Samtec |
Board to Board & Mezzanine Connectors 0.635 mm AcceleRate HP High-Performance Array Terminal |
auf Bestellung 360 Stücke: Lieferzeit 10-14 Tag (e) |
|
| APM6-100-01.5-L-08-0-TR |
|
Hersteller: Samtec Inc.
Description: 0.635 MM ACCELERATE HP HIGH-PERF
Number of Rows: 8
Mated Stacking Heights: 5mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.144" (3.66mm)
Pitch: 0.025" (0.64mm)
Number of Positions: 800
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: High Density Array, Female
Features: Board Guide
Packaging: Cut Tape (CT)
Description: 0.635 MM ACCELERATE HP HIGH-PERF
Number of Rows: 8
Mated Stacking Heights: 5mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.144" (3.66mm)
Pitch: 0.025" (0.64mm)
Number of Positions: 800
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: High Density Array, Female
Features: Board Guide
Packaging: Cut Tape (CT)
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 108.59 EUR |
| 10+ | 93.75 EUR |
| APM6-100-01.5-L-08-0-TR |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors 0.635 mm AcceleRate HP High-Performance Array Terminal
Board to Board & Mezzanine Connectors 0.635 mm AcceleRate HP High-Performance Array Terminal
auf Bestellung 360 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 117.53 EUR |
| 10+ | 111.27 EUR |
| 25+ | 107.1 EUR |
| 50+ | 104.47 EUR |
| 100+ | 90.96 EUR |
| 300+ | 79.31 EUR |