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APTGF50H60T2G Microchip Technology


326124007-aptgf50h60t2g-rev1-pdf.pdf Hersteller: Microchip Technology
Trans IGBT Module N-CH 600V 65A 250mW 22-Pin Case SP-2
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Technische Details APTGF50H60T2G Microchip Technology

Description: IGBT MODULE 600V 65A 250W SP3, Packaging: Bulk, Package / Case: SP3, Mounting Type: Chassis Mount, Input: Standard, Configuration: Full Bridge Inverter, Vce(on) (Max) @ Vge, Ic: 2.45V @ 15V, 50A, NTC Thermistor: Yes, Supplier Device Package: SP3, IGBT Type: NPT, Part Status: Obsolete, Current - Collector (Ic) (Max): 65 A, Voltage - Collector Emitter Breakdown (Max): 600 V, Power - Max: 250 W, Current - Collector Cutoff (Max): 250 µA, Input Capacitance (Cies) @ Vce: 2.2 nF @ 25 V.

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APTGF50H60T2G APTGF50H60T2G Hersteller : Microsemi Corporation APTGF50H60T2G.pdf Description: IGBT MODULE 600V 65A 250W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge Inverter
Vce(on) (Max) @ Vge, Ic: 2.45V @ 15V, 50A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: NPT
Part Status: Obsolete
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 250 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 2.2 nF @ 25 V
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