APTGX600DU170T6G Microchip Technology
Hersteller: Microchip Technology
Description: IGBT MODULE 1700V 750A 1.948KW
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 62500 pF @ 25 V
Current - Collector Cutoff (Max): 50 µA
Power - Max: 1.948 kW
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector (Ic) (Max): 750 A
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 600A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Dual, Common Emitter
Input: Standard
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Technische Details APTGX600DU170T6G Microchip Technology
Description: IGBT MODULE 1700V 750A 1.948KW, Mounting Type: Chassis Mount, Package / Case: Module, Packaging: Bulk, Input Capacitance (Cies) @ Vce: 62500 pF @ 25 V, Current - Collector Cutoff (Max): 50 µA, Power - Max: 1.948 kW, Voltage - Collector Emitter Breakdown (Max): 1700 V, Current - Collector (Ic) (Max): 750 A, NTC Thermistor: Yes, Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 600A, Operating Temperature: -40°C ~ 175°C (TJ), Configuration: Dual, Common Emitter, Input: Standard.
