
AR 16-HZL/01-TT Assmann WSW Components

Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
auf Bestellung 4301 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
10+ | 1.92 EUR |
11+ | 1.63 EUR |
29+ | 1.51 EUR |
58+ | 1.44 EUR |
116+ | 1.37 EUR |
261+ | 1.30 EUR |
522+ | 1.23 EUR |
1015+ | 1.18 EUR |
2523+ | 1.10 EUR |
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Technische Details AR 16-HZL/01-TT Assmann WSW Components
Description: CONN IC DIP SOCKET 16POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Thermoplastic, Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper.
Weitere Produktangebote AR 16-HZL/01-TT
Foto | Bezeichnung | Hersteller | Beschreibung |
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AR 16 HZL/01-TT | Hersteller : Assmann WSW Components |
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auf Bestellung 2090 Stücke: Lieferzeit 10-14 Tag (e) |
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AR16-HZL/01-TT | Hersteller : Assmann WSW Components | Description: CONN IC DIP SOCKET 16POS GOLD |
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