
AR 08-HZL/01-TT Assmann WSW Components

Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 3668 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
19+ | 0.97 EUR |
22+ | 0.83 EUR |
25+ | 0.77 EUR |
60+ | 0.73 EUR |
120+ | 0.69 EUR |
300+ | 0.65 EUR |
540+ | 0.62 EUR |
1020+ | 0.60 EUR |
2520+ | 0.56 EUR |
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Produktbewertung abgeben
Technische Details AR 08-HZL/01-TT Assmann WSW Components
Description: CONN IC DIP SOCKET 8POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Thermoplastic, Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote AR 08-HZL/01-TT
Foto | Bezeichnung | Hersteller | Beschreibung |
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AR 08 HZL/01-TT | Hersteller : Assmann WSW Components |
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auf Bestellung 4103 Stücke: Lieferzeit 10-14 Tag (e) |
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AR08-HZL/01-TT | Hersteller : Assmann WSW Components | Description: CONN IC DIP SOCKET 8POS GOLD |
Produkt ist nicht verfügbar |