AR 14-HZL/01-TT Assmann WSW Components
Hersteller: Assmann WSW ComponentsDescription: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 9429 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 11+ | 1.72 EUR |
| 14+ | 1.31 EUR |
| 33+ | 1.14 EUR |
| 66+ | 1.06 EUR |
| 132+ | 0.98 EUR |
| 264+ | 0.91 EUR |
| 528+ | 0.84 EUR |
| 1023+ | 0.78 EUR |
| 2508+ | 0.76 EUR |
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Technische Details AR 14-HZL/01-TT Assmann WSW Components
Description: CONN IC DIP SOCKET 14POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Thermoplastic, Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote AR 14-HZL/01-TT
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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AR14-HZL/01-TT | Hersteller : Assmann WSW Components |
Description: CONN IC DIP SOCKET 14POS GOLD |
Produkt ist nicht verfügbar |