AR 16 HZL-TT Assmann WSW Components
| Anzahl | Privatkunde |
|---|---|
| 13+ | 1.7 EUR |
| 15+ | 1.44 EUR |
| 29+ | 1.38 EUR |
| 58+ | 1.34 EUR |
| 87+ | 1.29 EUR |
| 232+ | 1.17 EUR |
| 464+ | 1.06 EUR |
| 957+ | 0.94 EUR |
| 2407+ | 0.84 EUR |
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Technische Details AR 16 HZL-TT Assmann WSW Components
Description: CONN IC DIP SOCKET 16POS TIN, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Thermoplastic, Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote AR 16 HZL-TT nach Preis ab 1.04 EUR bis 1.8 EUR
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AR 16-HZL-TT | Assmann WSW Components |
 Description: CONN IC DIP SOCKET 16POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 7605 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 16-HZL-TT |
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Hersteller: Assmann WSW Components
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 7605 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 1.8 EUR |
| 14+ | 1.54 EUR |
| 29+ | 1.43 EUR |
| 58+ | 1.36 EUR |
| 116+ | 1.29 EUR |
| 261+ | 1.21 EUR |
| 522+ | 1.15 EUR |
| 1015+ | 1.11 EUR |
| 2523+ | 1.04 EUR |