
AR 32-HZL/01-TT Assmann WSW Components

Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
auf Bestellung 1868 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
6+ | 3.19 EUR |
14+ | 2.52 EUR |
28+ | 2.37 EUR |
56+ | 2.23 EUR |
112+ | 2.09 EUR |
252+ | 1.95 EUR |
504+ | 1.83 EUR |
1008+ | 1.72 EUR |
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Technische Details AR 32-HZL/01-TT Assmann WSW Components
Description: CONN IC DIP SOCKET 32POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Thermoplastic, Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper.
Weitere Produktangebote AR 32-HZL/01-TT
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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AR-32-HZL/01-TT | Hersteller : Assmann WSW Components |
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auf Bestellung 708 Stücke: Lieferzeit 10-14 Tag (e) |
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AR 32-HZL/01-TT | Hersteller : Assmann WSW Components GMBH |
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Produkt ist nicht verfügbar |
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AR32-HZL/01-TT | Hersteller : Assmann WSW Components | Description: CONN IC DIP SOCKET 32POS GOLD |
Produkt ist nicht verfügbar |