ART.AGT-314 AG TERMOPASTY
Hersteller: AG TERMOPASTYCategory: Encapsulating materials
Description: Silicone encapsulating compound; white; -50÷180°C; 1.2g/cm3
Type of chemical agent: silicone encapsulating compound
Colour: white
Application: sealing and encapsulation of electronic circuits
Shore hardness: 20
Operating temperature: -50...180°C
Thermal conductivity: 1.5W/mK
Density: 1.2g/cm3
Dielectric strength: 14.4kV/mm
Mix ratio: 1:1
Bonding time: 70min
Appearance: liquid
Surface resistance: <22TΩ
Agent features: condensation cure; two-component
Net weight: 1kg
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Technische Details ART.AGT-314 AG TERMOPASTY
Category: Encapsulating materials, Description: Silicone encapsulating compound; white; -50÷180°C; 1.2g/cm3, Type of chemical agent: silicone encapsulating compound, Colour: white, Application: sealing and encapsulation of electronic circuits, Shore hardness: 20, Operating temperature: -50...180°C, Thermal conductivity: 1.5W/mK, Density: 1.2g/cm3, Dielectric strength: 14.4kV/mm, Mix ratio: 1:1, Bonding time: 70min, Appearance: liquid, Surface resistance: .