Technische Details ASP-184329-01 Samtec
Description: SAMTEC - ASP-184329-01 - Mezzanine-Steckverbinder, Array, Buchse, 1.27 mm, 14 Reihe(n), 560 Kontakt(e), Oberflächenmontage, tariffCode: 85366930, euEccn: NLR, rohsCompliant: YES, Kontaktüberzug: -, hazardous: false, rohsPhthalatesCompliant: YES, Kontaktmaterial: -, isCanonical: Y, Steckverbindermontage: Oberflächenmontage, Anzahl der Kontakte: 560Kontakt(e), SVHC: No SVHC (04-Feb-2026), Produktpalette: ASP, productTraceability: No, Kontaktanschluss: Oberflächenmontage, usEccn: EAR99, Anzahl der Reihen: 14Reihe(n), Mezzanine-Steckverbinder: Array, Buchse, Rastermaß: 1.27mm.
Weitere Produktangebote ASP-184329-01 nach Preis ab 41.2 EUR bis 79.06 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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ASP-184329-01 | Samtec Inc. |
 Description: CONN HD ARRAY RCPT SMD GOLDPackaging: Tape & Reel (TR) Features: Board Guide Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Pitch: 0.050" (1.27mm) Height Above Board: 0.258" (6.55mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm Number of Rows: 14 |
auf Bestellung 1650 Stücke: Lieferzeit 10-14 Tag (e) |
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ASP-184329-01 | Samtec Inc. |
Description: CONN HD ARRAY RCPT SMD GOLD Features: Board Guide Packaging: Tape & Reel (TR) Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Pitch: 0.050" (1.27mm) Height Above Board: 0.258" (6.55mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm Part Status: Active Number of Rows: 14 |
auf Bestellung 150 Stücke: Lieferzeit 10-14 Tag (e) |
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ASP-184329-01 | Samtec Inc. |
Description: CONN HD ARRAY RCPT SMD GOLD Packaging: Cut Tape (CT) Features: Board Guide Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Pitch: 0.050" (1.27mm) Height Above Board: 0.258" (6.55mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm Number of Rows: 14 |
auf Bestellung 1790 Stücke: Lieferzeit 10-14 Tag (e) |
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ASP-184329-01 | Samtec |
Conn Array Socket RCP 560 POS 1.27mm Solder ST Top Entry SMD T/R |
auf Bestellung 262 Stücke: Lieferzeit 14-21 Tag (e) |
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ASP-184329-01 | Samtec |
Conn Array Socket RCP 560 POS 1.27mm Solder ST Top Entry SMD T/R |
auf Bestellung 100 Stücke: Lieferzeit 14-21 Tag (e) |
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ASP-184329-01 | Samtec |
Conn Array Socket RCP 560 POS 1.27mm Solder ST Top Entry SMD T/R |
auf Bestellung 100 Stücke: Lieferzeit 14-21 Tag (e) |
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ASP-184329-01 | Samtec Inc. |
Description: CONN HD ARRAY RCPT SMD GOLD Features: Board Guide Packaging: Cut Tape (CT) Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Pitch: 0.050" (1.27mm) Height Above Board: 0.258" (6.55mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm Part Status: Active Number of Rows: 14 |
auf Bestellung 278 Stücke: Lieferzeit 10-14 Tag (e) |
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ASP-184329-01 | Samtec |
Board to Board & Mezzanine Connectors ASP |
auf Bestellung 626 Stücke: Lieferzeit 10-14 Tag (e) |
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ASP-184329-01 | SAMTEC |
Description: SAMTEC - ASP-184329-01 - Mezzanine-Steckverbinder, Array, Buchse, 1.27 mm, 14 Reihe(n), 560 Kontakt(e), Oberflächenmontage tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: - hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: - isCanonical: Y Steckverbindermontage: Oberflächenmontage Anzahl der Kontakte: 560Kontakt(e) SVHC: No SVHC (04-Feb-2026) Produktpalette: ASP productTraceability: No Kontaktanschluss: Oberflächenmontage usEccn: EAR99 Anzahl der Reihen: 14Reihe(n) Mezzanine-Steckverbinder: Array, Buchse Rastermaß: 1.27mm |
auf Bestellung 375 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| ASP-184329-01 |
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Hersteller: Samtec Inc.
Description: CONN HD ARRAY RCPT SMD GOLD
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Height Above Board: 0.258" (6.55mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm
Number of Rows: 14
Description: CONN HD ARRAY RCPT SMD GOLD
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Height Above Board: 0.258" (6.55mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm
Number of Rows: 14
auf Bestellung 1650 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 150+ | 52.3 EUR |
| 300+ | 44.98 EUR |
| ASP-184329-01 |
|
Hersteller: Samtec Inc.
Description: CONN HD ARRAY RCPT SMD GOLD
Features: Board Guide
Packaging: Tape & Reel (TR)
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Height Above Board: 0.258" (6.55mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm
Part Status: Active
Number of Rows: 14
Description: CONN HD ARRAY RCPT SMD GOLD
Features: Board Guide
Packaging: Tape & Reel (TR)
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Height Above Board: 0.258" (6.55mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm
Part Status: Active
Number of Rows: 14
auf Bestellung 150 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 150+ | 52.88 EUR |
| ASP-184329-01 |
|
Hersteller: Samtec Inc.
Description: CONN HD ARRAY RCPT SMD GOLD
Packaging: Cut Tape (CT)
Features: Board Guide
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Height Above Board: 0.258" (6.55mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm
Number of Rows: 14
Description: CONN HD ARRAY RCPT SMD GOLD
Packaging: Cut Tape (CT)
Features: Board Guide
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Height Above Board: 0.258" (6.55mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm
Number of Rows: 14
auf Bestellung 1790 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 52.94 EUR |
| 10+ | 45.01 EUR |
| 25+ | 42.19 EUR |
| 50+ | 41.2 EUR |
| ASP-184329-01 |
|
Hersteller: Samtec
Conn Array Socket RCP 560 POS 1.27mm Solder ST Top Entry SMD T/R
Conn Array Socket RCP 560 POS 1.27mm Solder ST Top Entry SMD T/R
auf Bestellung 262 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 56.69 EUR |
| 5+ | 53.49 EUR |
| 10+ | 51.34 EUR |
| 25+ | 49.34 EUR |
| 50+ | 47.87 EUR |
| ASP-184329-01 |
|
Hersteller: Samtec
Conn Array Socket RCP 560 POS 1.27mm Solder ST Top Entry SMD T/R
Conn Array Socket RCP 560 POS 1.27mm Solder ST Top Entry SMD T/R
auf Bestellung 100 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 64.62 EUR |
| ASP-184329-01 |
|
Hersteller: Samtec
Conn Array Socket RCP 560 POS 1.27mm Solder ST Top Entry SMD T/R
Conn Array Socket RCP 560 POS 1.27mm Solder ST Top Entry SMD T/R
auf Bestellung 100 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 77.22 EUR |
| 10+ | 70.75 EUR |
| 25+ | 63.81 EUR |
| 50+ | 52.38 EUR |
| 100+ | 44.3 EUR |
| ASP-184329-01 |
|
Hersteller: Samtec Inc.
Description: CONN HD ARRAY RCPT SMD GOLD
Features: Board Guide
Packaging: Cut Tape (CT)
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Height Above Board: 0.258" (6.55mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm
Part Status: Active
Number of Rows: 14
Description: CONN HD ARRAY RCPT SMD GOLD
Features: Board Guide
Packaging: Cut Tape (CT)
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Height Above Board: 0.258" (6.55mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm
Part Status: Active
Number of Rows: 14
auf Bestellung 278 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 78.98 EUR |
| 10+ | 75.04 EUR |
| 25+ | 70.29 EUR |
| 50+ | 60.02 EUR |
| ASP-184329-01 |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors ASP
Board to Board & Mezzanine Connectors ASP
auf Bestellung 626 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 79.06 EUR |
| 10+ | 75.1 EUR |
| 25+ | 70.35 EUR |
| 50+ | 60.08 EUR |
| 100+ | 52.94 EUR |
| 450+ | 45.51 EUR |
| ASP-184329-01 |
|
Hersteller: SAMTEC
Description: SAMTEC - ASP-184329-01 - Mezzanine-Steckverbinder, Array, Buchse, 1.27 mm, 14 Reihe(n), 560 Kontakt(e), Oberflächenmontage
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: -
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: -
isCanonical: Y
Steckverbindermontage: Oberflächenmontage
Anzahl der Kontakte: 560Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Produktpalette: ASP
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 14Reihe(n)
Mezzanine-Steckverbinder: Array, Buchse
Rastermaß: 1.27mm
Description: SAMTEC - ASP-184329-01 - Mezzanine-Steckverbinder, Array, Buchse, 1.27 mm, 14 Reihe(n), 560 Kontakt(e), Oberflächenmontage
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: -
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: -
isCanonical: Y
Steckverbindermontage: Oberflächenmontage
Anzahl der Kontakte: 560Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Produktpalette: ASP
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 14Reihe(n)
Mezzanine-Steckverbinder: Array, Buchse
Rastermaß: 1.27mm
auf Bestellung 375 Stücke:
Lieferzeit 14-21 Tag (e)