ASPI0002-P001A LOTES
Hersteller: LOTES
Description: SPI 8Pin WSON 8X6
Features: Board Guide, Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Phosphor Bronze
Part Status: Active
| Anzahl | Privatkunde |
|---|---|
| 10+ | 38.64 EUR |
| 50+ | 19.31 EUR |
| 100+ | 11.59 EUR |
| 200+ | 7.72 EUR |
| 700+ | 3.87 EUR |
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Technische Details ASPI0002-P001A LOTES
Description: SPI 8Pin WSON 8X6, Features: Board Guide, Closed Frame, Packaging: Tape & Reel (TR), Mounting Type: Surface Mount, Type: SOIC, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Liquid Crystal Polymer (LCP), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: FLASH, Contact Material - Post: Phosphor Bronze, Part Status: Active.