ATS-11E-25-C2-R0 Advanced Thermal Solutions Inc.
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 60X60X25MM XCUT T766
Fin Height: 0.984" (25.00mm)
Thermal Resistance @ Forced Air Flow: 6.26°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.362" (60.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.362" (60.00mm)
Material: Aluminum
Part Status: Active
Material Finish: Blue Anodized
Packaging: Tray
| Anzahl | Preis |
|---|---|
| 2+ | 17.2 EUR |
| 10+ | 16.73 EUR |
| 25+ | 15.8 EUR |
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Technische Details ATS-11E-25-C2-R0 Advanced Thermal Solutions Inc.
Description: HEATSINK 60X60X25MM XCUT T766, Fin Height: 0.984" (25.00mm), Thermal Resistance @ Forced Air Flow: 6.26°C/W @ 100 LFM, Attachment Method: Push Pin, Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Width: 2.362" (60.00mm), Type: Top Mount, Shape: Square, Fins, Length: 2.362" (60.00mm), Material: Aluminum, Part Status: Active, Material Finish: Blue Anodized, Packaging: Tray.