ATS-20H-33-C2-R0 Advanced Thermal Solutions Inc.
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 57.9X36.83X17.78MM T766
Thermal Resistance @ Forced Air Flow: 17.42°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.450" (36.83mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Material: Aluminum
Packaging: Bulk
Part Status: Active
Material Finish: Blue Anodized
Fin Height: 0.700" (17.78mm)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 20.11 EUR |
| 10+ | 19.58 EUR |
| 25+ | 18.48 EUR |
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Technische Details ATS-20H-33-C2-R0 Advanced Thermal Solutions Inc.
Description: HEATSINK 57.9X36.83X17.78MM T766, Thermal Resistance @ Forced Air Flow: 17.42°C/W @ 100 LFM, Attachment Method: Push Pin, Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Width: 1.450" (36.83mm), Type: Top Mount, Shape: Rectangular, Fins, Length: 2.280" (57.90mm), Material: Aluminum, Packaging: Bulk, Part Status: Active, Material Finish: Blue Anodized, Fin Height: 0.700" (17.78mm).