ATS-59002-C1-R0 Advanced Thermal Solutions Inc.
Hersteller: Advanced Thermal Solutions Inc.Description: HEAT SINK 25MM X 32MM X 13MM
Packaging: Bulk
Material: Aluminum
Length: 0.984" (25.00mm)
Shape: Rectangular, Angled Fins
Type: Top Mount
Width: 1.260" (32.00mm)
Package Cooled: Flip Chip Processors
Attachment Method: Clip
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Fin Height: 0.512" (13.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 77 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 54.82 EUR |
| 10+ | 51.6 EUR |
| 25+ | 48.38 EUR |
| 50+ | 45.15 EUR |
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Technische Details ATS-59002-C1-R0 Advanced Thermal Solutions Inc.
Description: HEAT SINK 25MM X 32MM X 13MM, Packaging: Bulk, Material: Aluminum, Length: 0.984" (25.00mm), Shape: Rectangular, Angled Fins, Type: Top Mount, Width: 1.260" (32.00mm), Package Cooled: Flip Chip Processors, Attachment Method: Clip, Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM, Fin Height: 0.512" (13.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote ATS-59002-C1-R0
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| ATS-59002-C1-R0 | Hersteller : Advanced Thermal Solutions |
Category: Heatsinks Description: Heatsink: attachable; grilled; BGA; black; L: 25mm; W: 46.5mm; H: 13mm Length: 25mm Manufacturer series: NXP Application: BGA Width: 46.5mm Height: 13mm Type of heatsink: attachable Heatsink shape: grilled Material finishing: anodized Thermal resistance @200 LFM: 6.5°C/W Colour: black Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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ATS-59002-C1-R0 | Hersteller : Advanced Thermal Solutions |
Heat Sinks maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 25mm Comp, 25x32x13mm |
Produkt ist nicht verfügbar |
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| ATS-59002-C1-R0 | Hersteller : Advanced Thermal Solutions |
Category: Heatsinks Description: Heatsink: attachable; grilled; BGA; black; L: 25mm; W: 46.5mm; H: 13mm Length: 25mm Manufacturer series: NXP Application: BGA Width: 46.5mm Height: 13mm Type of heatsink: attachable Heatsink shape: grilled Material finishing: anodized Thermal resistance @200 LFM: 6.5°C/W Colour: black |
Produkt ist nicht verfügbar |