ATS-PCB1059 Advanced Thermal Solutions
Hersteller: Advanced Thermal Solutions
Category: Heatsinks
Description: Heatsink: extruded; flat; TO220; silver; L: 31.8mm; W: 22.2mm; copper
Type of heatsink: extruded
Heatsink shape: flat
Application: TO220
Colour: silver
Length: 31.8mm
Width: 22.2mm
Height: 6.4mm
Material: copper
Material finishing: tin plated
Manufacturer series: STANDARD
Thermal resistance @200 LFM: 8.8°C/W
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Technische Details ATS-PCB1059 Advanced Thermal Solutions
Description: HEATSINK TO-220 COPPER W/TAB, Packaging: Bulk, Material: Copper, Length: 1.250" (31.75mm), Shape: Rectangular, Fins, Type: Board Level, Vertical, Width: 0.875" (22.22mm), Package Cooled: TO-220, Attachment Method: Bolt On and Board Mounts, Thermal Resistance @ Forced Air Flow: 8.80°C/W @ 200 LFM, Thermal Resistance @ Natural: 24.00°C/W, Fin Height: 0.250" (6.35mm), Material Finish: Tin.
Weitere Produktangebote ATS-PCB1059
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
ATS-PCB1059 | Advanced Thermal Solutions Inc. |
Description: HEATSINK TO-220 COPPER W/TAB Packaging: Bulk Material: Copper Length: 1.250" (31.75mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.875" (22.22mm) Package Cooled: TO-220 Attachment Method: Bolt On and Board Mounts Thermal Resistance @ Forced Air Flow: 8.80°C/W @ 200 LFM Thermal Resistance @ Natural: 24.00°C/W Fin Height: 0.250" (6.35mm) Material Finish: Tin |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
 |
ATS-PCB1059 | Advanced Thermal Solutions |
Heat Sinks BGA Heat Sink, Board Level Stamp, No TIM, Tin Plate, TO220, 31.75x22.22x6.35mm |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH |
| ATS-PCB1059 |
|
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK TO-220 COPPER W/TAB
Packaging: Bulk
Material: Copper
Length: 1.250" (31.75mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.875" (22.22mm)
Package Cooled: TO-220
Attachment Method: Bolt On and Board Mounts
Thermal Resistance @ Forced Air Flow: 8.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 24.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Tin
Description: HEATSINK TO-220 COPPER W/TAB
Packaging: Bulk
Material: Copper
Length: 1.250" (31.75mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.875" (22.22mm)
Package Cooled: TO-220
Attachment Method: Bolt On and Board Mounts
Thermal Resistance @ Forced Air Flow: 8.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 24.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Tin
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-PCB1059 |
|
Hersteller: Advanced Thermal Solutions
Heat Sinks BGA Heat Sink, Board Level Stamp, No TIM, Tin Plate, TO220, 31.75x22.22x6.35mm
Heat Sinks BGA Heat Sink, Board Level Stamp, No TIM, Tin Plate, TO220, 31.75x22.22x6.35mm
Produkt ist nicht verfügbar
Mindestbestellmenge: 10000 Stücke
Im Einkaufswagen
Stück im Wert von UAH