B32022A3823M189 EPCOS - TDK Electronics

Description: CAP FILM 0.082UF 20% 300VAC RAD
Packaging: Tape & Reel (TR)
Tolerance: ±20%
Package / Case: Radial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 110°C
Applications: EMI, RFI Suppression
Lead Spacing: 0.591" (15.00mm)
Termination: PC Pins
Ratings: Y2
Dielectric Material: Polypropylene (PP), Metallized
Voltage Rating - AC: 300V
Height - Seated (Max): 0.728" (18.50mm)
Part Status: Active
Capacitance: 0.082 µF
Size / Dimension: 0.709" L x 0.433" W (18.00mm x 11.00mm)
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Technische Details B32022A3823M189 EPCOS - TDK Electronics
Description: CAP FILM 0.082UF 20% 300VAC RAD, Packaging: Tape & Reel (TR), Tolerance: ±20%, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 110°C, Applications: EMI, RFI Suppression, Lead Spacing: 0.591" (15.00mm), Termination: PC Pins, Ratings: Y2, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - AC: 300V, Height - Seated (Max): 0.728" (18.50mm), Part Status: Active, Capacitance: 0.082 µF, Size / Dimension: 0.709" L x 0.433" W (18.00mm x 11.00mm).
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B32022A3823M189 | Hersteller : EPCOS / TDK |
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