
auf Bestellung 2299 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
2+ | 1.87 EUR |
10+ | 1.39 EUR |
25+ | 1.27 EUR |
100+ | 1.04 EUR |
250+ | 0.88 EUR |
500+ | 0.83 EUR |
900+ | 0.73 EUR |
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Technische Details B32912B3154M189 EPCOS / TDK
Description: CAP FILM 0.15UF 20% 760VDC RAD, Packaging: Tape & Reel (TR), Tolerance: ±20%, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 110°C, Applications: EMI, RFI Suppression, Lead Spacing: 0.591" (15.00mm), Termination: PC Pins, Ratings: X1, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - AC: 330V, Voltage Rating - DC: 760V, Height - Seated (Max): 0.492" (12.50mm), Part Status: Active, Capacitance: 0.15 µF, Size / Dimension: 0.709" L x 0.276" W (18.00mm x 7.00mm).
Weitere Produktangebote B32912B3154M189
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B32912B3154M189 | Hersteller : TDK ELECTRONICS |
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Produkt ist nicht verfügbar |
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B32912B3154M189 | Hersteller : EPCOS - TDK Electronics |
![]() Packaging: Tape & Reel (TR) Tolerance: ±20% Package / Case: Radial Mounting Type: Through Hole Operating Temperature: -40°C ~ 110°C Applications: EMI, RFI Suppression Lead Spacing: 0.591" (15.00mm) Termination: PC Pins Ratings: X1 Dielectric Material: Polypropylene (PP), Metallized Voltage Rating - AC: 330V Voltage Rating - DC: 760V Height - Seated (Max): 0.492" (12.50mm) Part Status: Active Capacitance: 0.15 µF Size / Dimension: 0.709" L x 0.276" W (18.00mm x 7.00mm) |
Produkt ist nicht verfügbar |