Technische Details B32914B5684M000 TDK ELECTRONICS
Description: CAP FILM 0.68UF 20% 530VAC RAD, Packaging: Bulk, Tolerance: ±20%, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 110°C, Applications: EMI, RFI Suppression, Lead Spacing: 1.083" (27.50mm), Termination: PC Pins, Ratings: X1, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - AC: 530V, Height - Seated (Max): 1.083" (27.50mm), Capacitance: 0.68 µF, Size / Dimension: 1.240" L x 0.709" W (31.50mm x 18.00mm).
Weitere Produktangebote B32914B5684M000
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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| B32914B5684M000 | Hersteller : EPCOS - TDK Electronics |
 Description: CAP FILM 0.68UF 20% 530VAC RADPackaging: Bulk Tolerance: ±20% Package / Case: Radial Mounting Type: Through Hole Operating Temperature: -40°C ~ 110°C Applications: EMI, RFI Suppression Lead Spacing: 1.083" (27.50mm) Termination: PC Pins Ratings: X1 Dielectric Material: Polypropylene (PP), Metallized Voltage Rating - AC: 530V Height - Seated (Max): 1.083" (27.50mm) Capacitance: 0.68 µF Size / Dimension: 1.240" L x 0.709" W (31.50mm x 18.00mm) |
Produkt ist nicht verfügbar |
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| B32914B5684M000 | Hersteller : TDK |
Film Capacitors FILM CAP MKT (85/85/1000) X2 0.33 F 20% 305Vac LS 22.5mm |
Produkt ist nicht verfügbar |
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B32914B5684M000 | Hersteller : EPCOS / TDK |
Safety Capacitors FILM CAP MKP X1 0.68uF 20% 530Vac LS 27.5mm |
Produkt ist nicht verfügbar |