Technische Details B32922C3274M000 TDK ELECTRONICS
Description: CAP FILM 0.27UF 20% 630VDC RAD, Packaging: Bulk, Tolerance: ±20%, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 110°C, Applications: EMI, RFI Suppression, Lead Spacing: 0.591" (15.00mm), Termination: PC Pins, Ratings: X2, Dielectric Material: Polypropylene (PP), Voltage Rating - AC: 305V, Voltage Rating - DC: 630V, Part Status: Active, Capacitance: 0.27 µF.
Weitere Produktangebote B32922C3274M000
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
 |
B32922C3274M000 | Hersteller : EPCOS - TDK Electronics |
 Description: CAP FILM 0.27UF 20% 630VDC RADPackaging: Bulk Tolerance: ±20% Package / Case: Radial Mounting Type: Through Hole Operating Temperature: -40°C ~ 110°C Applications: EMI, RFI Suppression Lead Spacing: 0.591" (15.00mm) Termination: PC Pins Ratings: X2 Dielectric Material: Polypropylene (PP) Voltage Rating - AC: 305V Voltage Rating - DC: 630V Part Status: Active Capacitance: 0.27 µF |
Produkt ist nicht verfügbar |
|
 |
B32922C3274M000 | Hersteller : EPCOS / TDK |
Safety Capacitors FILM CAP MKP X2 0.27uF 20% 305Vac LS 15mm |
Produkt ist nicht verfügbar |