Technische Details B32923H3474K000 TDK ELECTRONICS
Description: CAP FILM 0.47UF 10% 630VDC RAD, Tolerance: ±10%, Features: 85C/85% Humidity, Packaging: Bulk, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 110°C, Applications: Automotive; EMI, RFI Suppression, Lead Spacing: 0.886" (22.50mm), Termination: PC Pins, Ratings: AEC-Q200, X2, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - AC: 305V, Voltage Rating - DC: 630V, Height - Seated (Max): 0.650" (16.50mm), Capacitance: 0.47 µF, Size / Dimension: 1.043" L x 0.413" W (26.50mm x 10.50mm).
Weitere Produktangebote B32923H3474K000
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B32923H3474K000 | Hersteller : TDK |
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B32923H3474K000 | Hersteller : EPCOS - TDK Electronics |
![]() Tolerance: ±10% Features: 85C/85% Humidity Packaging: Bulk Package / Case: Radial Mounting Type: Through Hole Operating Temperature: -40°C ~ 110°C Applications: Automotive; EMI, RFI Suppression Lead Spacing: 0.886" (22.50mm) Termination: PC Pins Ratings: AEC-Q200, X2 Dielectric Material: Polypropylene (PP), Metallized Voltage Rating - AC: 305V Voltage Rating - DC: 630V Height - Seated (Max): 0.650" (16.50mm) Capacitance: 0.47 µF Size / Dimension: 1.043" L x 0.413" W (26.50mm x 10.50mm) |
Produkt ist nicht verfügbar |
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B32923H3474K000 | Hersteller : EPCOS / TDK |
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Produkt ist nicht verfügbar |