
B81122A1683M EPCOS - TDK Electronics

Description: CAP FILM 0.068UF 20% 250VAC RAD
Packaging: Bulk
Tolerance: ±20%
Package / Case: Radial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 100°C
Applications: EMI, RFI Suppression
Lead Spacing: 0.886" (22.50mm)
Termination: PC Pins
Dielectric Material: Polypropylene (PP)
Voltage Rating - AC: 250V
Height - Seated (Max): 0.650" (16.50mm)
Capacitance: 0.068 µF
Size / Dimension: 1.043" L x 0.413" W (26.50mm x 10.50mm)
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Technische Details B81122A1683M EPCOS - TDK Electronics
Description: CAP FILM 0.068UF 20% 250VAC RAD, Packaging: Bulk, Tolerance: ±20%, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 100°C, Applications: EMI, RFI Suppression, Lead Spacing: 0.886" (22.50mm), Termination: PC Pins, Dielectric Material: Polypropylene (PP), Voltage Rating - AC: 250V, Height - Seated (Max): 0.650" (16.50mm), Capacitance: 0.068 µF, Size / Dimension: 1.043" L x 0.413" W (26.50mm x 10.50mm).
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B81122A1683M | Hersteller : EPCOS / TDK |
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