BC57E687C-GITB-E4 Qualcomm
Hersteller: Qualcomm
Description: IC RF TXRX+MCU BLUTOOTH 169TFBGA
Memory Size: 48kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -90dBm
Package / Case: 169-TFBGA
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Serial Interfaces: I²C, I²S, UART, USB
RF Family/Standard: Bluetooth
GPIO: 16
Supplier Device Package: 169-TFBGA (8x8)
Data Rate (Max): 3Mbps
Protocol: Bluetooth v2.1 +EDR, Class 2 and 3
Power - Output: 8dBm
Voltage - Supply: 1.5V
DigiKey Programmable: Not Verified
Type: TxRx + MCU
Produktrezensionen
Produktbewertung abgeben
Technische Details BC57E687C-GITB-E4 Qualcomm
Description: IC RF TXRX+MCU BLUTOOTH 169TFBGA, Memory Size: 48kB RAM, Frequency: 2.4GHz, Mounting Type: Surface Mount, Sensitivity: -90dBm, Package / Case: 169-TFBGA, Packaging: Tape & Reel (TR), Part Status: Obsolete, Serial Interfaces: I²C, I²S, UART, USB, RF Family/Standard: Bluetooth, GPIO: 16, Supplier Device Package: 169-TFBGA (8x8), Data Rate (Max): 3Mbps, Protocol: Bluetooth v2.1 +EDR, Class 2 and 3, Power - Output: 8dBm, Voltage - Supply: 1.5V, DigiKey Programmable: Not Verified, Type: TxRx + MCU.
Weitere Produktangebote BC57E687C-GITB-E4
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
|
|
BC57E687C-GITB-E4 | Hersteller : Qualcomm |
Description: IC RF TXRX+MCU BLUTOOTH 169TFBGA Part Status: Obsolete Serial Interfaces: I²C, I²S, UART, USB RF Family/Standard: Bluetooth GPIO: 16 Supplier Device Package: 169-TFBGA (8x8) Protocol: Bluetooth v2.1 +EDR, Class 2 and 3 Power - Output: 8dBm Voltage - Supply: 1.5V Type: TxRx + MCU Memory Size: 48kB RAM Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -90dBm Package / Case: 169-TFBGA Packaging: Cut Tape (CT) DigiKey Programmable: Not Verified Data Rate (Max): 3Mbps |
Produkt ist nicht verfügbar |
|
| BC57E687C-GITB-E4 | Hersteller : RF360 |
Qualcomm |
Produkt ist nicht verfügbar |