Technische Details BC57E687C-GITB-E4 Qualcomm Inc
Description: IC RF TXRX+MCU BLUTOOTH 169TFBGA, Packaging: Tape & Reel (TR), Package / Case: 169-TFBGA, Sensitivity: -90dBm, Mounting Type: Surface Mount, Frequency: 2.4GHz, Memory Size: 48kB RAM, Type: TxRx + MCU, Voltage - Supply: 1.5V, Power - Output: 8dBm, Protocol: Bluetooth v2.1 +EDR, Class 2 and 3, Data Rate (Max): 3Mbps, Supplier Device Package: 169-TFBGA (8x8), GPIO: 16, RF Family/Standard: Bluetooth, Serial Interfaces: I²C, I²S, UART, USB, Part Status: Obsolete, DigiKey Programmable: Not Verified.
Weitere Produktangebote BC57E687C-GITB-E4
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BC57E687C-GITB-E4 | Hersteller : Qualcomm |
 Description: IC RF TXRX+MCU BLUTOOTH 169TFBGAPackaging: Tape & Reel (TR) Package / Case: 169-TFBGA Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 48kB RAM Type: TxRx + MCU Voltage - Supply: 1.5V Power - Output: 8dBm Protocol: Bluetooth v2.1 +EDR, Class 2 and 3 Data Rate (Max): 3Mbps Supplier Device Package: 169-TFBGA (8x8) GPIO: 16 RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, UART, USB Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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BC57E687C-GITB-E4 | Hersteller : Qualcomm |
Description: IC RF TXRX+MCU BLUTOOTH 169TFBGA Packaging: Cut Tape (CT) Package / Case: 169-TFBGA Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 48kB RAM Type: TxRx + MCU Voltage - Supply: 1.5V Power - Output: 8dBm Protocol: Bluetooth v2.1 +EDR, Class 2 and 3 Data Rate (Max): 3Mbps Supplier Device Package: 169-TFBGA (8x8) GPIO: 16 RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, UART, USB Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| BC57E687C-GITB-E4 | Hersteller : RF360 |
Qualcomm |
Produkt ist nicht verfügbar |