BD71801GWL-E2 Rohm Semiconductor
Hersteller: Rohm Semiconductor
Description: IC REG 17OUT BCK/LNR SYNC 50UCSP
Packaging: Tape & Reel (TR)
Package / Case: 80-UFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -35°C ~ 85°C
Voltage - Supply: 2.6V ~ 5.5V
Applications: Mobile Communications
Current - Supply: 580µA
Supplier Device Package: 80-UCSP50L3C (3.8x3.8)
Part Status: Not For New Designs
Description: IC REG 17OUT BCK/LNR SYNC 50UCSP
Packaging: Tape & Reel (TR)
Package / Case: 80-UFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -35°C ~ 85°C
Voltage - Supply: 2.6V ~ 5.5V
Applications: Mobile Communications
Current - Supply: 580µA
Supplier Device Package: 80-UCSP50L3C (3.8x3.8)
Part Status: Not For New Designs
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details BD71801GWL-E2 Rohm Semiconductor
Description: IC REG 17OUT BCK/LNR SYNC 50UCSP, Packaging: Tape & Reel (TR), Package / Case: 80-UFBGA, CSPBGA, Mounting Type: Surface Mount, Operating Temperature: -35°C ~ 85°C, Voltage - Supply: 2.6V ~ 5.5V, Applications: Mobile Communications, Current - Supply: 580µA, Supplier Device Package: 80-UCSP50L3C (3.8x3.8), Part Status: Not For New Designs.
Weitere Produktangebote BD71801GWL-E2
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
BD71801GWL-E2 | Hersteller : ROHM Semiconductor | Power Management Specialised - PMIC DAC 8-CH R-2R 8-Bit 16-Pin SSOP-B T/R |
Produkt ist nicht verfügbar |