BDN09-3CB CTS Thermal Management Products
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Hersteller: CTS Thermal Management ProductsDescription: HEATSINK CPU .91" SQ
Packaging: Box
Material: Aluminum
Length: 0.910" (23.11mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.910" (23.11mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 400 LFM
Thermal Resistance @ Natural: 26.90°C/W
Fin Height: 0.355" (9.02mm)
Material Finish: Black Anodized
auf Bestellung 513 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 8+ | 2.43 EUR |
| 10+ | 2.31 EUR |
| 25+ | 2.25 EUR |
| 50+ | 2.19 EUR |
| 100+ | 2.07 EUR |
| 250+ | 1.95 EUR |
| 500+ | 1.83 EUR |
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Technische Details BDN09-3CB CTS Thermal Management Products
Description: HEATSINK CPU .91" SQ, Packaging: Box, Material: Aluminum, Length: 0.910" (23.11mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.910" (23.11mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Not Included), Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 400 LFM, Thermal Resistance @ Natural: 26.90°C/W, Fin Height: 0.355" (9.02mm), Material Finish: Black Anodized.