Produkte > CTS THERMAL MANAGEMENT PRODUCTS > BDN09-3CB
BDN09-3CB

BDN09-3CB CTS Thermal Management Products

BDN09-3CB(%5EA01).jpg
Hersteller: CTS Thermal Management Products
Description: HEATSINK CPU .91" SQ
Material: Aluminum
Packaging: Box
Material Finish: Black Anodized
Fin Height: 0.355" (9.02mm)
Thermal Resistance @ Natural: 26.90°C/W
Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 400 LFM
Attachment Method: Thermal Tape, Adhesive (Not Included)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.910" (23.11mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 0.910" (23.11mm)
auf Bestellung 513 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.43 EUR
10+2.31 EUR
25+2.25 EUR
50+2.19 EUR
100+2.07 EUR
250+1.95 EUR
500+1.83 EUR
Mindestbestellmenge: 8
Im Einkaufswagen  Stück im Wert von  UAH
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Technische Details BDN09-3CB CTS Thermal Management Products

Description: HEATSINK CPU .91" SQ, Material: Aluminum, Packaging: Box, Material Finish: Black Anodized, Fin Height: 0.355" (9.02mm), Thermal Resistance @ Natural: 26.90°C/W, Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 400 LFM, Attachment Method: Thermal Tape, Adhesive (Not Included), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Width: 0.910" (23.11mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 0.910" (23.11mm).