
BDN09-3CB/A01 CTS Thermal Management Products

Description: HEATSINK CPU W/ADHESIVE .91"SQ
Packaging: Box
Material: Aluminum
Length: 0.910" (23.11mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.910" (23.11mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 400 LFM
Thermal Resistance @ Natural: 26.90°C/W
Fin Height: 0.355" (9.02mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2277 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
5+ | 4.19 EUR |
10+ | 3.71 EUR |
25+ | 3.54 EUR |
50+ | 3.41 EUR |
100+ | 3.29 EUR |
250+ | 3.13 EUR |
500+ | 3.02 EUR |
1232+ | 2.88 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details BDN09-3CB/A01 CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE .91"SQ, Packaging: Box, Material: Aluminum, Length: 0.910" (23.11mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.910" (23.11mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 400 LFM, Thermal Resistance @ Natural: 26.90°C/W, Fin Height: 0.355" (9.02mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote BDN09-3CB/A01 nach Preis ab 3.34 EUR bis 4.86 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
BDN093CBA01 | Hersteller : CTS Electronic Components |
![]() |
auf Bestellung 2523 Stücke: Lieferzeit 10-14 Tag (e) |
|