BDN09-3CB/A01

BDN09-3CB/A01 CTS Thermal Management Products


CTS-Thermal-Heatsinks-Peel-Stick-Datasheet.pdf Hersteller: CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE .91"SQ
Packaging: Box
Material: Aluminum
Length: 0.910" (23.11mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.910" (23.11mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 400 LFM
Thermal Resistance @ Natural: 26.90°C/W
Fin Height: 0.355" (9.02mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2277 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+4.19 EUR
10+3.71 EUR
25+3.54 EUR
50+3.41 EUR
100+3.29 EUR
250+3.13 EUR
500+3.02 EUR
1232+2.88 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details BDN09-3CB/A01 CTS Thermal Management Products

Description: HEATSINK CPU W/ADHESIVE .91"SQ, Packaging: Box, Material: Aluminum, Length: 0.910" (23.11mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.910" (23.11mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 400 LFM, Thermal Resistance @ Natural: 26.90°C/W, Fin Height: 0.355" (9.02mm), Material Finish: Black Anodized, Part Status: Active.

Weitere Produktangebote BDN09-3CB/A01 nach Preis ab 3.34 EUR bis 4.86 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
BDN093CBA01 BDN093CBA01 Hersteller : CTS Electronic Components ADHESIVE_PEEL_AND_STICK_HEAT_SINKS-2487475.pdf Heat Sinks IERC Heat Sink 0.91x0.91x0.355
auf Bestellung 2523 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+4.86 EUR
10+4.75 EUR
25+4.36 EUR
100+4.1 EUR
250+3.85 EUR
500+3.71 EUR
1000+3.34 EUR
Im Einkaufswagen  Stück im Wert von  UAH