BDN103CBA01 CTS Electronic Components
auf Bestellung 1688 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 4.1 EUR |
| 25+ | 3.94 EUR |
| 100+ | 3.64 EUR |
| 250+ | 3.54 EUR |
| 500+ | 3.43 EUR |
| 1000+ | 3.33 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details BDN103CBA01 CTS Electronic Components
Description: HEATSINK CPU W/ADHESIVE 1.01"SQ, Packaging: Box, Material: Aluminum, Length: 1.010" (25.65mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.010" (25.65mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM, Thermal Resistance @ Natural: 26.40°C/W, Fin Height: 0.355" (9.02mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote BDN103CBA01 nach Preis ab 3.56 EUR bis 4.79 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
BDN10-3CB/A01 | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK CPU W/ADHESIVE 1.01"SQPackaging: Box Material: Aluminum Length: 1.010" (25.65mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.010" (25.65mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM Thermal Resistance @ Natural: 26.40°C/W Fin Height: 0.355" (9.02mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 439 Stücke: Lieferzeit 10-14 Tag (e) |
|