BDN113CBA01 CTS Electronic Components
auf Bestellung 1237 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 4.56 EUR |
| 10+ | 4.45 EUR |
| 25+ | 4.1 EUR |
| 100+ | 3.85 EUR |
| 250+ | 3.63 EUR |
| 500+ | 3.56 EUR |
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Technische Details BDN113CBA01 CTS Electronic Components
Description: HEATSINK CPU W/ADHESIVE 1.11"SQ, Packaging: Box, Material: Aluminum, Length: 1.110" (28.19mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.110" (28.19mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 7.20°C/W @ 400 LFM, Thermal Resistance @ Natural: 20.90°C/W, Fin Height: 0.355" (9.02mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote BDN113CBA01
| Foto | Bezeichnung | Hersteller | Beschreibung |
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BDN11-3CB/A01 | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK CPU W/ADHESIVE 1.11"SQPackaging: Box Material: Aluminum Length: 1.110" (28.19mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.110" (28.19mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 7.20°C/W @ 400 LFM Thermal Resistance @ Natural: 20.90°C/W Fin Height: 0.355" (9.02mm) Material Finish: Black Anodized Part Status: Active |
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