BDN11-3CB/A01 CTS Thermal Management Products
Hersteller: CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.11"SQ
Packaging: Box
Material: Aluminum
Length: 1.110" (28.19mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.110" (28.19mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 7.20°C/W @ 400 LFM
Thermal Resistance @ Natural: 20.90°C/W
Fin Height: 0.355" (9.02mm)
Material Finish: Black Anodized
Part Status: Active
| Anzahl | Privatkunde |
|---|---|
| 4+ | 5.99 EUR |
| 10+ | 5.31 EUR |
| 25+ | 5.05 EUR |
| 50+ | 4.87 EUR |
| 100+ | 4.69 EUR |
| 250+ | 4.47 EUR |
| 500+ | 4.31 EUR |
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Technische Details BDN11-3CB/A01 CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.11"SQ, Packaging: Box, Material: Aluminum, Length: 1.110" (28.19mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.110" (28.19mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 7.20°C/W @ 400 LFM, Thermal Resistance @ Natural: 20.90°C/W, Fin Height: 0.355" (9.02mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote BDN11-3CB/A01 nach Preis ab 4.24 EUR bis 5.43 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BDN113CBA01 | CTS Electronic Components |
Heat Sinks IERC Heat Sink 1.11x1.11x0.355 |
auf Bestellung 1237 Stücke: Lieferzeit 10-14 Tag (e) |
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| BDN113CBA01 |
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Hersteller: CTS Electronic Components
Heat Sinks IERC Heat Sink 1.11x1.11x0.355
Heat Sinks IERC Heat Sink 1.11x1.11x0.355
auf Bestellung 1237 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 5.43 EUR |
| 10+ | 5.3 EUR |
| 25+ | 4.88 EUR |
| 100+ | 4.58 EUR |
| 250+ | 4.32 EUR |
| 500+ | 4.24 EUR |