BDN123CBA01 CTS Electronic Components
auf Bestellung 518 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 3.57 EUR |
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Technische Details BDN123CBA01 CTS Electronic Components
Description: HEATSINK CPU W/ADHESIVE 1.21"SQ, Packaging: Tray, Material: Aluminum, Length: 1.210" (30.73mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.210" (30.73mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 6.80°C/W @ 400 LFM, Thermal Resistance @ Natural: 19.60°C/W, Fin Height: 0.355" (9.02mm), Material Finish: Black Anodized.
Weitere Produktangebote BDN123CBA01
| Foto | Bezeichnung | Hersteller | Beschreibung |
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BDN12-3CB/A01 | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK CPU W/ADHESIVE 1.21"SQPackaging: Tray Material: Aluminum Length: 1.210" (30.73mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.210" (30.73mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 6.80°C/W @ 400 LFM Thermal Resistance @ Natural: 19.60°C/W Fin Height: 0.355" (9.02mm) Material Finish: Black Anodized |
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