BDN123CBA01 CTS Electronic Components


CTS_Thermal_Heatsinks_Peel_Stick_Datasheet-1510952.pdf Hersteller: CTS Electronic Components
Heat Sinks IERC Heat Sink 1.21x1.21x0.355
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Lieferzeit 10-14 Tag (e)
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1+3.57 EUR
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Technische Details BDN123CBA01 CTS Electronic Components

Description: HEATSINK CPU W/ADHESIVE 1.21"SQ, Packaging: Tray, Material: Aluminum, Length: 1.210" (30.73mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.210" (30.73mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 6.80°C/W @ 400 LFM, Thermal Resistance @ Natural: 19.60°C/W, Fin Height: 0.355" (9.02mm), Material Finish: Black Anodized.

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BDN12-3CB/A01 BDN12-3CB/A01 Hersteller : CTS Thermal Management Products Heat-Dissipators.pdf Description: HEATSINK CPU W/ADHESIVE 1.21"SQ
Packaging: Tray
Material: Aluminum
Length: 1.210" (30.73mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.210" (30.73mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 6.80°C/W @ 400 LFM
Thermal Resistance @ Natural: 19.60°C/W
Fin Height: 0.355" (9.02mm)
Material Finish: Black Anodized
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