BDN12-5CB/A01

BDN12-5CB/A01 CTS Thermal Management Products


CTS-Thermal-Heatsinks-Peel-Stick-Datasheet.pdf Hersteller: CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.21"SQ
Packaging: Box
Material: Aluminum
Length: 1.210" (30.73mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.210" (30.73mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 400 LFM
Thermal Resistance @ Natural: 16.50°C/W
Fin Height: 0.555" (14.10mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 711 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.68 EUR
10+5.02 EUR
25+4.79 EUR
50+4.61 EUR
100+4.45 EUR
250+4.23 EUR
500+4.08 EUR
Mindestbestellmenge: 4
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Technische Details BDN12-5CB/A01 CTS Thermal Management Products

Description: HEATSINK CPU W/ADHESIVE 1.21"SQ, Packaging: Box, Material: Aluminum, Length: 1.210" (30.73mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.210" (30.73mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 400 LFM, Thermal Resistance @ Natural: 16.50°C/W, Fin Height: 0.555" (14.10mm), Material Finish: Black Anodized, Part Status: Active.

Weitere Produktangebote BDN12-5CB/A01

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BDN125CBA01 Hersteller : CTS Electronic Components CTS_Thermal_Heatsinks_Peel_Stick_Datasheet-1510952.pdf Heat Sinks IERC Heat Sink 1.21x1.21x0.555
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH