BDN12-5CB/A01 CTS Thermal Management Products
Hersteller: CTS Thermal Management ProductsDescription: HEATSINK CPU W/ADHESIVE 1.21"SQ
Packaging: Box
Material: Aluminum
Length: 1.210" (30.73mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.210" (30.73mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 400 LFM
Thermal Resistance @ Natural: 16.50°C/W
Fin Height: 0.555" (14.10mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 711 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 5.68 EUR |
| 10+ | 5.02 EUR |
| 25+ | 4.79 EUR |
| 50+ | 4.61 EUR |
| 100+ | 4.45 EUR |
| 250+ | 4.23 EUR |
| 500+ | 4.08 EUR |
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Technische Details BDN12-5CB/A01 CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.21"SQ, Packaging: Box, Material: Aluminum, Length: 1.210" (30.73mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.210" (30.73mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 400 LFM, Thermal Resistance @ Natural: 16.50°C/W, Fin Height: 0.555" (14.10mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote BDN12-5CB/A01
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| BDN125CBA01 | Hersteller : CTS Electronic Components |
Heat Sinks IERC Heat Sink 1.21x1.21x0.555 |
Produkt ist nicht verfügbar |