BDN13-3CB/A01 CTS Thermal Management Products
Hersteller: CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.31"SQ
Packaging: Box
Material: Aluminum
Length: 1.310" (33.27mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.310" (33.27mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 16.10°C/W
Fin Height: 0.355" (9.02mm)
Material Finish: Black Anodized
| Anzahl | Preis |
|---|---|
| 4+ | 5.7 EUR |
| 10+ | 5.04 EUR |
| 25+ | 4.8 EUR |
| 50+ | 4.63 EUR |
| 100+ | 4.46 EUR |
| 250+ | 4.25 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details BDN13-3CB/A01 CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.31"SQ, Packaging: Box, Material: Aluminum, Length: 1.310" (33.27mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.310" (33.27mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 400 LFM, Thermal Resistance @ Natural: 16.10°C/W, Fin Height: 0.355" (9.02mm), Material Finish: Black Anodized.
Weitere Produktangebote BDN13-3CB/A01 nach Preis ab 4.05 EUR bis 5.77 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
BDN133CBA01 | Hersteller : CTS Electronic Components |
Heat Sinks IERC Heat Sink 1.31x1.31x0.355 |
auf Bestellung 1310 Stücke: Lieferzeit 122-126 Tag (e) |
|