BDN133CBA01 CTS Electronic Components
auf Bestellung 1310 Stücke:
Lieferzeit 122-126 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 5.77 EUR |
| 10+ | 5.63 EUR |
| 25+ | 5.17 EUR |
| 100+ | 4.88 EUR |
| 250+ | 4.56 EUR |
| 500+ | 4.42 EUR |
| 1000+ | 4.05 EUR |
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Technische Details BDN133CBA01 CTS Electronic Components
Description: HEATSINK CPU W/ADHESIVE 1.31"SQ, Packaging: Box, Material: Aluminum, Length: 1.310" (33.27mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.310" (33.27mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 400 LFM, Thermal Resistance @ Natural: 16.10°C/W, Fin Height: 0.355" (9.02mm), Material Finish: Black Anodized.
Weitere Produktangebote BDN133CBA01 nach Preis ab 4.35 EUR bis 6.39 EUR
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BDN13-3CB/A01 | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK CPU W/ADHESIVE 1.31"SQPackaging: Box Material: Aluminum Length: 1.310" (33.27mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.310" (33.27mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 400 LFM Thermal Resistance @ Natural: 16.10°C/W Fin Height: 0.355" (9.02mm) Material Finish: Black Anodized |
auf Bestellung 1338 Stücke: Lieferzeit 10-14 Tag (e) |
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