BDN13-3CB/A01 CTS Thermal Management Products
Hersteller: CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.31"SQ
Packaging: Box
Material: Aluminum
Length: 1.310" (33.27mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.310" (33.27mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 16.10°C/W
Fin Height: 0.355" (9.02mm)
Material Finish: Black Anodized
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.78 EUR |
| 10+ | 6 EUR |
| 25+ | 5.71 EUR |
| 50+ | 5.51 EUR |
| 100+ | 5.31 EUR |
| 250+ | 5.06 EUR |
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Technische Details BDN13-3CB/A01 CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.31"SQ, Packaging: Box, Material: Aluminum, Length: 1.310" (33.27mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.310" (33.27mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 400 LFM, Thermal Resistance @ Natural: 16.10°C/W, Fin Height: 0.355" (9.02mm), Material Finish: Black Anodized.
Weitere Produktangebote BDN13-3CB/A01 nach Preis ab 4.82 EUR bis 6.87 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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BDN133CBA01 | CTS Electronic Components |
Heat Sinks IERC Heat Sink 1.31x1.31x0.355 |
auf Bestellung 1310 Stücke: Lieferzeit 122-126 Tag (e) |
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| BDN133CBA01 |
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Hersteller: CTS Electronic Components
Heat Sinks IERC Heat Sink 1.31x1.31x0.355
Heat Sinks IERC Heat Sink 1.31x1.31x0.355
auf Bestellung 1310 Stücke:
Lieferzeit 122-126 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 6.87 EUR |
| 10+ | 6.7 EUR |
| 25+ | 6.15 EUR |
| 100+ | 5.81 EUR |
| 250+ | 5.43 EUR |
| 500+ | 5.26 EUR |
| 1000+ | 4.82 EUR |