BDN14-3CB/A01

BDN14-3CB/A01 CTS Thermal Management Products


CTS-Thermal-Heatsinks-Peel-Stick-Datasheet.pdf Hersteller: CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.41"SQ
Packaging: Box
Material: Aluminum
Length: 1.410" (35.81mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.410" (35.81mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 5.60°C/W @ 400 LFM
Thermal Resistance @ Natural: 16.20°C/W
Fin Height: 0.355" (9.02mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 3932 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.28 EUR
10+4.69 EUR
25+4.47 EUR
50+4.31 EUR
100+4.16 EUR
250+3.97 EUR
500+3.83 EUR
1000+3.69 EUR
Mindestbestellmenge: 4
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Technische Details BDN14-3CB/A01 CTS Thermal Management Products

Description: HEATSINK CPU W/ADHESIVE 1.41"SQ, Packaging: Box, Material: Aluminum, Length: 1.410" (35.81mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.410" (35.81mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 5.60°C/W @ 400 LFM, Thermal Resistance @ Natural: 16.20°C/W, Fin Height: 0.355" (9.02mm), Material Finish: Black Anodized, Part Status: Active.

Weitere Produktangebote BDN14-3CB/A01

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Preis
BDN143CBA01 Hersteller : CTS Electronic Components 1912.pdf Heat Sinks IERC Heat Sink 1.41x1.41x0.355
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH