
BDN186CBA01 CTS Electronic Components
auf Bestellung 2635 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 9.66 EUR |
10+ | 9.38 EUR |
25+ | 8.85 EUR |
50+ | 8.32 EUR |
100+ | 7.83 EUR |
250+ | 7.3 EUR |
500+ | 6.78 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details BDN186CBA01 CTS Electronic Components
Description: HEATSINK CPU W/ADHESIVE 1.81"SQ, Packaging: Box, Material: Aluminum, Length: 1.810" (45.97mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.810" (45.97mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 400 LFM, Thermal Resistance @ Natural: 8.10°C/W, Fin Height: 0.605" (15.37mm), Material Finish: Black Anodized.
Weitere Produktangebote BDN186CBA01 nach Preis ab 7.05 EUR bis 10.1 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
BDN18-6CB/A01 | Hersteller : CTS Thermal Management Products |
![]() Packaging: Box Material: Aluminum Length: 1.810" (45.97mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.810" (45.97mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 400 LFM Thermal Resistance @ Natural: 8.10°C/W Fin Height: 0.605" (15.37mm) Material Finish: Black Anodized |
auf Bestellung 1617 Stücke: Lieferzeit 10-14 Tag (e) |
|