BDN18-6CB/A01 CTS Thermal Management Products
Hersteller: CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.81"SQ
Packaging: Box
Material: Aluminum
Length: 1.810" (45.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.810" (45.97mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 400 LFM
Thermal Resistance @ Natural: 8.10°C/W
Fin Height: 0.605" (15.37mm)
Material Finish: Black Anodized
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.35 EUR |
| 10+ | 10.04 EUR |
| 25+ | 9.57 EUR |
| 50+ | 9.22 EUR |
| 100+ | 8.89 EUR |
| 250+ | 8.46 EUR |
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Technische Details BDN18-6CB/A01 CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.81"SQ, Packaging: Box, Material: Aluminum, Length: 1.810" (45.97mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.810" (45.97mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 400 LFM, Thermal Resistance @ Natural: 8.10°C/W, Fin Height: 0.605" (15.37mm), Material Finish: Black Anodized.
Weitere Produktangebote BDN18-6CB/A01 nach Preis ab 8.07 EUR bis 11.5 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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BDN186CBA01 | CTS Electronic Components |
Heat Sinks IERC Heat Sink 1.81x1.81x0.605 |
auf Bestellung 2635 Stücke: Lieferzeit 10-14 Tag (e) |
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| BDN186CBA01 |
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Hersteller: CTS Electronic Components
Heat Sinks IERC Heat Sink 1.81x1.81x0.605
Heat Sinks IERC Heat Sink 1.81x1.81x0.605
auf Bestellung 2635 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 11.5 EUR |
| 10+ | 11.16 EUR |
| 25+ | 10.53 EUR |
| 50+ | 9.9 EUR |
| 100+ | 9.32 EUR |
| 250+ | 8.69 EUR |
| 500+ | 8.07 EUR |


