BDN18-3CB/A01 CTS Thermal Management Products
Hersteller: CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.81"SQ
Packaging: Box
Material: Aluminum
Length: 1.810" (45.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.810" (45.97mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 3.50°C/W @ 400 LFM
Thermal Resistance @ Natural: 10.80°C/W
Fin Height: 0.355" (9.02mm)
Material Finish: Black Anodized
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.89 EUR |
| 10+ | 9.64 EUR |
| 25+ | 9.38 EUR |
| 50+ | 8.85 EUR |
| 100+ | 8.33 EUR |
| 250+ | 7.82 EUR |
| 500+ | 7.56 EUR |
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Technische Details BDN18-3CB/A01 CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.81"SQ, Packaging: Box, Material: Aluminum, Length: 1.810" (45.97mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.810" (45.97mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 3.50°C/W @ 400 LFM, Thermal Resistance @ Natural: 10.80°C/W, Fin Height: 0.355" (9.02mm), Material Finish: Black Anodized.
Weitere Produktangebote BDN18-3CB/A01 nach Preis ab 6.53 EUR bis 9.57 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BDN183CBA01 | CTS Electronic Components |
Heat Sinks IERC Heat Sink 1.81x1.81x0.355 |
auf Bestellung 1194 Stücke: Lieferzeit 10-14 Tag (e) |
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| BDN183CBA01 |
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Hersteller: CTS Electronic Components
Heat Sinks IERC Heat Sink 1.81x1.81x0.355
Heat Sinks IERC Heat Sink 1.81x1.81x0.355
auf Bestellung 1194 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 9.57 EUR |
| 10+ | 9.32 EUR |
| 25+ | 8.82 EUR |
| 100+ | 8.04 EUR |
| 250+ | 7.56 EUR |
| 500+ | 7.31 EUR |
| 1000+ | 6.53 EUR |