BDN18-3CB/A01 CTS Thermal Management Products
Hersteller: CTS Thermal Management ProductsDescription: HEATSINK CPU W/ADHESIVE 1.81"SQ
Packaging: Box
Material: Aluminum
Length: 1.810" (45.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.810" (45.97mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 3.50°C/W @ 400 LFM
Thermal Resistance @ Natural: 10.80°C/W
Fin Height: 0.355" (9.02mm)
Material Finish: Black Anodized
auf Bestellung 813 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 8.31 EUR |
| 10+ | 8.10 EUR |
| 25+ | 7.88 EUR |
| 50+ | 7.44 EUR |
| 100+ | 7.00 EUR |
| 250+ | 6.57 EUR |
| 500+ | 6.35 EUR |
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Technische Details BDN18-3CB/A01 CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.81"SQ, Packaging: Box, Material: Aluminum, Length: 1.810" (45.97mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.810" (45.97mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 3.50°C/W @ 400 LFM, Thermal Resistance @ Natural: 10.80°C/W, Fin Height: 0.355" (9.02mm), Material Finish: Black Anodized.
Weitere Produktangebote BDN18-3CB/A01 nach Preis ab 5.49 EUR bis 8.04 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||||||
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| BDN183CBA01 | Hersteller : CTS Electronic Components |
Heat Sinks IERC Heat Sink 1.81x1.81x0.355 |
auf Bestellung 1194 Stücke: Lieferzeit 10-14 Tag (e) |
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