
BDN18-3CB/A01 CTS Thermal Management Products

Description: HEATSINK CPU W/ADHESIVE 1.81"SQ
Packaging: Box
Material: Aluminum
Length: 1.810" (45.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.810" (45.97mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 3.50°C/W @ 400 LFM
Thermal Resistance @ Natural: 10.80°C/W
Fin Height: 0.355" (9.02mm)
Material Finish: Black Anodized
auf Bestellung 813 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
3+ | 8.31 EUR |
10+ | 8.10 EUR |
25+ | 7.88 EUR |
50+ | 7.44 EUR |
100+ | 7.00 EUR |
250+ | 6.57 EUR |
500+ | 6.35 EUR |
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Technische Details BDN18-3CB/A01 CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.81"SQ, Packaging: Box, Material: Aluminum, Length: 1.810" (45.97mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.810" (45.97mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 3.50°C/W @ 400 LFM, Thermal Resistance @ Natural: 10.80°C/W, Fin Height: 0.355" (9.02mm), Material Finish: Black Anodized.
Weitere Produktangebote BDN18-3CB/A01 nach Preis ab 5.49 EUR bis 8.04 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
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BDN183CBA01 | Hersteller : CTS Electronic Components |
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auf Bestellung 1194 Stücke: Lieferzeit 10-14 Tag (e) |
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