BGA0029 Chip Quik Inc.
Hersteller: Chip Quik Inc.Description: BGA-36 TO DIP-36 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 1.800" W (17.78mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 70.68 EUR |
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Technische Details BGA0029 Chip Quik Inc.
Description: BGA-36 TO DIP-36 SMT ADAPTER (0., Packaging: Bulk, Size / Dimension: 0.700" L x 1.800" W (17.78mm x 45.72mm), Material: FR4 Epoxy Glass, Number of Positions: 36, Pitch: 0.014" (0.35mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: BGA.