BGAP2D30AE6327XTSA1 Infineon Technologies
| Anzahl | Privatkunde |
|---|---|
| 1+ | 10.41 EUR |
| 10+ | 7.94 EUR |
| 25+ | 7.31 EUR |
| 100+ | 6.62 EUR |
| 250+ | 6.31 EUR |
| 500+ | 6.12 EUR |
| 1000+ | 6.03 EUR |
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Technische Details BGAP2D30AE6327XTSA1 Infineon Technologies
Description: WIRELESS INFRASTRUCTURE, Packaging: Tape & Reel (TR), Package / Case: 16-WFDFN Exposed Pad, Mounting Type: Surface Mount, Frequency: 3.3GHz ~ 4.2GHz, RF Type: 4G, 5G, Voltage - Supply: 4.75V ~ 5.25V, Gain: 35.2dB, Current - Supply: 121mA, Noise Figure: 3.1dB, P1dB: 28.5dBm, Supplier Device Package: PG-TSNP-16-13.
Weitere Produktangebote BGAP2D30AE6327XTSA1 nach Preis ab 6.31 EUR bis 12.78 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BGAP2D30AE6327XTSA1 | Infineon Technologies |
 Description: WIRELESS INFRASTRUCTUREPackaging: Tape & Reel (TR) Package / Case: 16-WFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.3GHz ~ 4.2GHz RF Type: 4G, 5G Voltage - Supply: 4.75V ~ 5.25V Gain: 35.2dB Current - Supply: 121mA Noise Figure: 3.1dB P1dB: 28.5dBm Supplier Device Package: PG-TSNP-16-13 |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BGAP2D30AE6327XTSA1 | Infineon Technologies |
Description: WIRELESS INFRASTRUCTURE Packaging: Cut Tape (CT) Package / Case: 16-WFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.3GHz ~ 4.2GHz RF Type: 4G, 5G Voltage - Supply: 4.75V ~ 5.25V Gain: 35.2dB Current - Supply: 121mA Noise Figure: 3.1dB P1dB: 28.5dBm Supplier Device Package: PG-TSNP-16-13 |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
|
| BGAP2D30AE6327XTSA1 |
|
Hersteller: Infineon Technologies
Description: WIRELESS INFRASTRUCTURE
Packaging: Tape & Reel (TR)
Package / Case: 16-WFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 4.2GHz
RF Type: 4G, 5G
Voltage - Supply: 4.75V ~ 5.25V
Gain: 35.2dB
Current - Supply: 121mA
Noise Figure: 3.1dB
P1dB: 28.5dBm
Supplier Device Package: PG-TSNP-16-13
Description: WIRELESS INFRASTRUCTURE
Packaging: Tape & Reel (TR)
Package / Case: 16-WFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 4.2GHz
RF Type: 4G, 5G
Voltage - Supply: 4.75V ~ 5.25V
Gain: 35.2dB
Current - Supply: 121mA
Noise Figure: 3.1dB
P1dB: 28.5dBm
Supplier Device Package: PG-TSNP-16-13
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2000+ | 6.31 EUR |
| BGAP2D30AE6327XTSA1 |
|
Hersteller: Infineon Technologies
Description: WIRELESS INFRASTRUCTURE
Packaging: Cut Tape (CT)
Package / Case: 16-WFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 4.2GHz
RF Type: 4G, 5G
Voltage - Supply: 4.75V ~ 5.25V
Gain: 35.2dB
Current - Supply: 121mA
Noise Figure: 3.1dB
P1dB: 28.5dBm
Supplier Device Package: PG-TSNP-16-13
Description: WIRELESS INFRASTRUCTURE
Packaging: Cut Tape (CT)
Package / Case: 16-WFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 4.2GHz
RF Type: 4G, 5G
Voltage - Supply: 4.75V ~ 5.25V
Gain: 35.2dB
Current - Supply: 121mA
Noise Figure: 3.1dB
P1dB: 28.5dBm
Supplier Device Package: PG-TSNP-16-13
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.78 EUR |
| 10+ | 9.81 EUR |
| 25+ | 8.91 EUR |
| 100+ | 7.84 EUR |
| 250+ | 7.27 EUR |
| 500+ | 6.9 EUR |
| 1000+ | 6.58 EUR |