BGAP2D30AE6327XTSA1 Infineon Technologies
| Anzahl | Privatkunde |
|---|---|
| 1+ | 10.41 EUR |
| 10+ | 7.94 EUR |
| 25+ | 7.31 EUR |
| 100+ | 6.62 EUR |
| 250+ | 6.31 EUR |
| 500+ | 6.12 EUR |
| 1000+ | 6.03 EUR |
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Technische Details BGAP2D30AE6327XTSA1 Infineon Technologies
Description: WIRELESS INFRASTRUCTURE, Supplier Device Package: PG-TSNP-16-13, P1dB: 28.5dBm, Noise Figure: 3.1dB, Current - Supply: 121mA, Gain: 35.2dB, Voltage - Supply: 4.75V ~ 5.25V, RF Type: 4G, 5G, Frequency: 3.3GHz ~ 4.2GHz, Mounting Type: Surface Mount, Package / Case: 16-WFDFN Exposed Pad, Packaging: Tape & Reel (TR).
Weitere Produktangebote BGAP2D30AE6327XTSA1 nach Preis ab 6.31 EUR bis 12.78 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BGAP2D30AE6327XTSA1 | Infineon Technologies |
 Description: WIRELESS INFRASTRUCTURESupplier Device Package: PG-TSNP-16-13 P1dB: 28.5dBm Noise Figure: 3.1dB Current - Supply: 121mA Gain: 35.2dB Voltage - Supply: 4.75V ~ 5.25V RF Type: 4G, 5G Frequency: 3.3GHz ~ 4.2GHz Mounting Type: Surface Mount Package / Case: 16-WFDFN Exposed Pad Packaging: Tape & Reel (TR) |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
|
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| BGAP2D30AE6327XTSA1 | Infineon Technologies |
Description: WIRELESS INFRASTRUCTURE Supplier Device Package: PG-TSNP-16-13 P1dB: 28.5dBm Noise Figure: 3.1dB Current - Supply: 121mA Gain: 35.2dB Voltage - Supply: 4.75V ~ 5.25V RF Type: 4G, 5G Frequency: 3.3GHz ~ 4.2GHz Mounting Type: Surface Mount Package / Case: 16-WFDFN Exposed Pad Packaging: Cut Tape (CT) |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
|
| BGAP2D30AE6327XTSA1 |
|
Hersteller: Infineon Technologies
Description: WIRELESS INFRASTRUCTURE
Supplier Device Package: PG-TSNP-16-13
P1dB: 28.5dBm
Noise Figure: 3.1dB
Current - Supply: 121mA
Gain: 35.2dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: 4G, 5G
Frequency: 3.3GHz ~ 4.2GHz
Mounting Type: Surface Mount
Package / Case: 16-WFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: WIRELESS INFRASTRUCTURE
Supplier Device Package: PG-TSNP-16-13
P1dB: 28.5dBm
Noise Figure: 3.1dB
Current - Supply: 121mA
Gain: 35.2dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: 4G, 5G
Frequency: 3.3GHz ~ 4.2GHz
Mounting Type: Surface Mount
Package / Case: 16-WFDFN Exposed Pad
Packaging: Tape & Reel (TR)
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2000+ | 6.31 EUR |
| BGAP2D30AE6327XTSA1 |
|
Hersteller: Infineon Technologies
Description: WIRELESS INFRASTRUCTURE
Supplier Device Package: PG-TSNP-16-13
P1dB: 28.5dBm
Noise Figure: 3.1dB
Current - Supply: 121mA
Gain: 35.2dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: 4G, 5G
Frequency: 3.3GHz ~ 4.2GHz
Mounting Type: Surface Mount
Package / Case: 16-WFDFN Exposed Pad
Packaging: Cut Tape (CT)
Description: WIRELESS INFRASTRUCTURE
Supplier Device Package: PG-TSNP-16-13
P1dB: 28.5dBm
Noise Figure: 3.1dB
Current - Supply: 121mA
Gain: 35.2dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: 4G, 5G
Frequency: 3.3GHz ~ 4.2GHz
Mounting Type: Surface Mount
Package / Case: 16-WFDFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.78 EUR |
| 10+ | 9.81 EUR |
| 25+ | 8.91 EUR |
| 100+ | 7.84 EUR |
| 250+ | 7.27 EUR |
| 500+ | 6.9 EUR |
| 1000+ | 6.58 EUR |