Technische Details BGSF110GN26E6327XTSA1 Infineon Technologies
Description: IC RF SWITCH SP10T 3.8GHZ TSNP26, Packaging: Tape & Reel (TR), Package / Case: 26-WFQFN Exposed Pad, Impedance: 50Ohm, Mounting Type: Surface Mount, Circuit: SP10T, RF Type: GSM, LTE, W-CDMA, Operating Temperature: -30°C ~ 85°C, Voltage - Supply: 2.4V ~ 3.3V, Insertion Loss: 1.3dB, Frequency Range: 100MHz ~ 3.8GHz, Test Frequency: 3GHz, Isolation: 40dB, Supplier Device Package: PG-TSNP-26-2.
Weitere Produktangebote BGSF110GN26E6327XTSA1
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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BGSF110GN26E6327XTSA1 | Infineon Technologies |
 Description: IC RF SWITCH SP10T 3.8GHZ TSNP26Packaging: Tape & Reel (TR) Package / Case: 26-WFQFN Exposed Pad Impedance: 50Ohm Mounting Type: Surface Mount Circuit: SP10T RF Type: GSM, LTE, W-CDMA Operating Temperature: -30°C ~ 85°C Voltage - Supply: 2.4V ~ 3.3V Insertion Loss: 1.3dB Frequency Range: 100MHz ~ 3.8GHz Test Frequency: 3GHz Isolation: 40dB Supplier Device Package: PG-TSNP-26-2 |
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Im Einkaufswagen Stück im Wert von UAH |
| BGSF110GN26E6327XTSA1 |
|
Hersteller: Infineon Technologies
Description: IC RF SWITCH SP10T 3.8GHZ TSNP26
Packaging: Tape & Reel (TR)
Package / Case: 26-WFQFN Exposed Pad
Impedance: 50Ohm
Mounting Type: Surface Mount
Circuit: SP10T
RF Type: GSM, LTE, W-CDMA
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.3V
Insertion Loss: 1.3dB
Frequency Range: 100MHz ~ 3.8GHz
Test Frequency: 3GHz
Isolation: 40dB
Supplier Device Package: PG-TSNP-26-2
Description: IC RF SWITCH SP10T 3.8GHZ TSNP26
Packaging: Tape & Reel (TR)
Package / Case: 26-WFQFN Exposed Pad
Impedance: 50Ohm
Mounting Type: Surface Mount
Circuit: SP10T
RF Type: GSM, LTE, W-CDMA
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.3V
Insertion Loss: 1.3dB
Frequency Range: 100MHz ~ 3.8GHz
Test Frequency: 3GHz
Isolation: 40dB
Supplier Device Package: PG-TSNP-26-2
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH