BI57SN42AG1-B/T Ø 0.50 25 G CYNEL
Hersteller: CYNEL
Category: Solder wires - lead free
Description: Tin; lead free; Bi57Sn42Ag1; 0.5mm; 25g; reel; Flux: flux free
Version: for soft soldering
Alloy composition: Bi57Sn42Ag1
Kind of package: reel
Kind of flux: flux free
Soldering equipment features: good wettability of solder pads
Application: in the electronics industry
Kind of solder: lead free
Appearance: soldering wire; solid
Type of solder: tin
Diameter: 0.5mm
Binder weight: 25g
Melting point: 138°C
Category: Solder wires - lead free
Description: Tin; lead free; Bi57Sn42Ag1; 0.5mm; 25g; reel; Flux: flux free
Version: for soft soldering
Alloy composition: Bi57Sn42Ag1
Kind of package: reel
Kind of flux: flux free
Soldering equipment features: good wettability of solder pads
Application: in the electronics industry
Kind of solder: lead free
Appearance: soldering wire; solid
Type of solder: tin
Diameter: 0.5mm
Binder weight: 25g
Melting point: 138°C
auf Bestellung 21 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 23.82 EUR |
| 5+ | 22.34 EUR |
| 10+ | 20.85 EUR |
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Technische Details BI57SN42AG1-B/T Ø 0.50 25 G CYNEL
Category: Solder wires - lead free, Description: Tin; lead free; Bi57Sn42Ag1; 0.5mm; 25g; reel; Flux: flux free, Version: for soft soldering, Alloy composition: Bi57Sn42Ag1, Kind of package: reel, Kind of flux: flux free, Soldering equipment features: good wettability of solder pads, Application: in the electronics industry, Kind of solder: lead free, Appearance: soldering wire; solid, Type of solder: tin, Diameter: 0.5mm, Binder weight: 25g, Melting point: 138°C.