Produkte > CYNEL > BI57SN42AG1-B/T Ø 1.25 25 G

BI57SN42AG1-B/T Ø 1.25 25 G CYNEL


Bi57Sn42Ag1-EN.pdf
Hersteller: CYNEL
Category: Solder wires - lead free
Description: Tin; lead free; Bi57Sn42Ag1; 1.25mm; 25g; reel; Flux: flux free
Kind of flux: flux free
Appearance: soldering wire; solid
Kind of package: reel
Melting point: 138°C
Soldering equipment features: good wettability of solder pads
Alloy composition: Bi57Sn42Ag1
Binder weight: 25g
Application: in the electronics industry
Diameter: 1.25mm
Kind of solder: lead free
Version: for soft soldering
Type of solder: tin
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Technische Details BI57SN42AG1-B/T Ø 1.25 25 G CYNEL

Category: Solder wires - lead free, Description: Tin; lead free; Bi57Sn42Ag1; 1.25mm; 25g; reel; Flux: flux free, Kind of flux: flux free, Appearance: soldering wire; solid, Kind of package: reel, Melting point: 138°C, Soldering equipment features: good wettability of solder pads, Alloy composition: Bi57Sn42Ag1, Binder weight: 25g, Application: in the electronics industry, Diameter: 1.25mm, Kind of solder: lead free, Version: for soft soldering, Type of solder: tin.